Three-Dimensional Printing of Abrasive, Hard, and Thermally Conductive Synthetic Microdiamond-Polymer Composite Using Low-Cost Fused Deposition Modeling Printer.

3D printing composite fused deposition modeling heat sinks hydrophilicity microdiamonds recyclable thermal conductivity

Journal

ACS applied materials & interfaces
ISSN: 1944-8252
Titre abrégé: ACS Appl Mater Interfaces
Pays: United States
ID NLM: 101504991

Informations de publication

Date de publication:
30 Jan 2019
Historique:
pubmed: 10 1 2019
medline: 10 1 2019
entrez: 10 1 2019
Statut: ppublish

Résumé

A relative lack of printable materials with tailored functional properties limits the applicability of three-dimensional (3D) printing. In this work, a diamond-acrylonitrile butadiene styrene (ABS) composite filament for use in 3D printing was created through incorporation of high-pressure and high-temperature (HPHT) synthetic microdiamonds as a filler. Homogenously distributed diamond composite filaments, containing either 37.5 or 60 wt % microdiamonds, were formed through preblending the diamond powder with ABS, followed by subsequent multiple fiber extrusions. The thermal conductivity of the ABS base material increased from 0.17 to 0.94 W/(m·K), more than five-fold following incorporation of the microdiamonds. The elastic modulus for the 60 wt % microdiamond containing composite material increased by 41.9% with respect to pure ABS, from 1050 to 1490 MPa. The hydrophilicity also increased by 32%. A low-cost fused deposition modeling printer was customized to handle the highly abrasive composite filament by replacing the conventional (stainless-steel) filament feeding gear with a harder titanium gear. To demonstrate improved thermal performance of 3D printed devices using the new composite filament, a number of composite heat sinks were printed and characterized. Heat dissipation measurements demonstrated that 3D printed heat sinks containing 60 wt % diamond increased the thermal dissipation by 42%.

Identifiants

pubmed: 30623658
doi: 10.1021/acsami.8b18232
doi:

Types de publication

Journal Article

Langues

eng

Pagination

4353-4363

Auteurs

Syamak Farajikhah (S)

ARC Centre of Excellence for Electromaterials Science (ACES), AIIM Facility, Innovation Campus , University of Wollongong , Wollongong , NSW 2500 , Australia.

Sepidar Sayyar (S)

ARC Centre of Excellence for Electromaterials Science (ACES), AIIM Facility, Innovation Campus , University of Wollongong , Wollongong , NSW 2500 , Australia.

Peter C Innis (PC)

ARC Centre of Excellence for Electromaterials Science (ACES), AIIM Facility, Innovation Campus , University of Wollongong , Wollongong , NSW 2500 , Australia.

Stephen Beirne (S)

ARC Centre of Excellence for Electromaterials Science (ACES), AIIM Facility, Innovation Campus , University of Wollongong , Wollongong , NSW 2500 , Australia.

Grant Barnsley (G)

ARC Centre of Excellence for Electromaterials Science (ACES), AIIM Facility, Innovation Campus , University of Wollongong , Wollongong , NSW 2500 , Australia.

Classifications MeSH