Outcomes of the Use of Hyaluronic Acid-Based Wound Dressings for the Treatment of Partial-Thickness Facial Burns.
Journal
Journal of burn care & research : official publication of the American Burn Association
ISSN: 1559-0488
Titre abrégé: J Burn Care Res
Pays: England
ID NLM: 101262774
Informations de publication
Date de publication:
02 May 2023
02 May 2023
Historique:
pubmed:
5
2
2019
medline:
5
2
2019
entrez:
5
2
2019
Statut:
ppublish
Résumé
The purpose of this study was to assess clinical, functional and cosmetic outcomes of the use of hyaluronic acid-based wound dressings for partial-thickness facial burns. Patients with partial-thickness facial burns hospitalized at the Burn Center between April 2014 and April 2017 were evaluated. Data pertaining to demographic characteristics, etiology, and degree of burn and percentage of burn to TBSA were collected. Pain, infection rates, reapplication rates, length of hospital stay, duration of healing, and presence of scar formation were analyzed. Median percentage of burn to TBSA was 15% (interquartile range [IQR]: 9-20). Fifteen patients had only facial burns, while 39 patients had burns on other parts of the body in addition to the face. Nine patients had deep partial-thickness burns, while 45 had superficial partial-thickness burns. Median length of hospital stay was 7 days (IQR: 3-15) for the entire study population and 4 days (IQR: 2-7.5) for patients who had only facial burns. Median healing time was 9 days (IQR: 7-12). Fifty-one (94%) patients had a Vancouver Scar Scale score of zero at 6 months. Use of hyaluronic acid-based wound dressings for facial burns is an effective and safe option.
Identifiants
pubmed: 30715375
pii: 5306021
doi: 10.1093/jbcr/irz004
doi:
Types de publication
Journal Article
Langues
eng
Sous-ensembles de citation
IM
Pagination
551-554Informations de copyright
© The Author(s) 2019. Published by Oxford University Press on behalf of the American Burn Association. All rights reserved. For permissions, please e-mail: journals.permissions@oup.com.