Technological Platform for Vertical Multi-Wafer Integration of Microscanners and Micro-Optical Components.

MOEMS confocal microscopy micro-optics multi-wafer bonding vertical integration

Journal

Micromachines
ISSN: 2072-666X
Titre abrégé: Micromachines (Basel)
Pays: Switzerland
ID NLM: 101640903

Informations de publication

Date de publication:
13 Mar 2019
Historique:
received: 12 02 2019
revised: 26 02 2019
accepted: 04 03 2019
entrez: 16 3 2019
pubmed: 16 3 2019
medline: 16 3 2019
Statut: epublish

Résumé

We describe an original integration technological platform for the miniaturization of micromachined on-chip optical microscopes, such as the laser scanning confocal microscope. The platform employs the multi-wafer vertical integration approach, combined with integrated glass-based micro-optics as well as micro-electro-mechanical systems (MEMS) components, where the assembly uses the heterogeneous bonding and interconnecting technologies. Various heterogeneous components are disposed in vertically stacked building blocks (glass microlens, MEMS actuator, beamsplitter, etc.) in a minimum space. The platform offers the integrity and potential of MEMS microactuators integrated with micro-optics, providing miniaturized and low cost solutions to create micromachined on-chip optical microscopes.

Identifiants

pubmed: 30871213
pii: mi10030185
doi: 10.3390/mi10030185
pmc: PMC6471930
pii:
doi:

Types de publication

Journal Article

Langues

eng

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Auteurs

Sylwester Bargiel (S)

Département MN2S, FEMTO-ST (UMR CNRS 6714), University of Bourgogne Franche-Comté (UBFC), 15B Avenue des Montboucons, 25030 Besançon, CEDEX, France. sylwester.bargiel@femto-st.fr.

Maciej Baranski (M)

Département MN2S, FEMTO-ST (UMR CNRS 6714), University of Bourgogne Franche-Comté (UBFC), 15B Avenue des Montboucons, 25030 Besançon, CEDEX, France. maciej@smart.mit.edu.

Maik Wiemer (M)

System Packaging Department, Fraunhofer Institute for Electronic Nanosystems (ENAS), Technologie-Campus 3, 09126 Chemnitz, Germany. Maik.Wiemer@enas.fraunhofer.de.

Jörg Frömel (J)

System Packaging Department, Fraunhofer Institute for Electronic Nanosystems (ENAS), Technologie-Campus 3, 09126 Chemnitz, Germany. joerg.froemel.e5@tohoku.ac.jp.

Wei-Shan Wang (WS)

System Packaging Department, Fraunhofer Institute for Electronic Nanosystems (ENAS), Technologie-Campus 3, 09126 Chemnitz, Germany. Wei-Shan.Wang@infineon.com.

Christophe Gorecki (C)

Département MN2S, FEMTO-ST (UMR CNRS 6714), University of Bourgogne Franche-Comté (UBFC), 15B Avenue des Montboucons, 25030 Besançon, CEDEX, France. christophe.gorecki@femto-st.fr.

Classifications MeSH