Influence of chlorides and phosphates on the antiadhesive, antibacterial, and electrochemical properties of an electroplated copper-silver alloy.

Antimicrobial surfaces such as copper alloys can reduce the spread of pathogenic microorganisms, e.g., in healthcare settings; however, the surface chemistry and thus the antibacterial activity are influenced by environmental parameters such as cleaning and disinfection procedures. Therefore, the purpose of the present study was to assess how copper-complexing compounds (chlorides and phosphates), common to the clinical environment, can affect the surface chemistry and the antiadhesive and antibacterial properties of a newly developed antibacterial copper-silver alloy and the single alloying metals. The authors demonstrated that the antiadhesion efficacy against S. aureus 8325 was the highest when the copper-silver alloy and copper surfaces (four- and two-log bacterial reduction compared to stainless steel controls, respectively) were exposed to chloride-containing suspensions. This was explained by the electrochemical activity of copper that dissolved as Cu