Thermal Conductivity Reduction in a Silicon Thin Film with Nanocones.
nanocones
silicon
surface phonon engineering
thermal conductivity
thermoelectrics
Journal
ACS applied materials & interfaces
ISSN: 1944-8252
Titre abrégé: ACS Appl Mater Interfaces
Pays: United States
ID NLM: 101504991
Informations de publication
Date de publication:
18 Sep 2019
18 Sep 2019
Historique:
pubmed:
7
9
2019
medline:
7
9
2019
entrez:
7
9
2019
Statut:
ppublish
Résumé
Modern thermoelectric devices incline toward inexpensive, environmentally friendly, and CMOS-compatible materials, such as silicon. To improve the thermoelectric performance of silicon, researchers try to decrease its thermal conductivity using various nanostructuring methods. However, most of these methods have limited efficiency because they are costly and damaging for the internal structure of silicon. Here, we propose a cost-effective, large-area, and maskless nanofabrication method that creates external nanocones on the silicon surface while preserving its interior. Our experiments show that these nanocones reduce the thermal conductivity of thin silicon membranes by more than 40%. Using a modified Callaway-Holland model, we study how the thermal conductivity is affected by various phonon scattering processes in the 4-295 K temperature range. We conclude that the nanocones generate additional surface scattering, which causes the thermal conductivity reduction. The proposed nanocones and their simple fabrication method are promising for the planar thermoelectric devices based on silicon.
Identifiants
pubmed: 31490655
doi: 10.1021/acsami.9b08797
doi:
Types de publication
Journal Article
Langues
eng
Sous-ensembles de citation
IM