Vertical Leakage in GaN-on-Si Stacks Investigated by a Buffer Decomposition Experiment.
Gallium nitride (GaN) high-electron-mobility transistors (HEMTs)
buffer trapping effect
vertical breakdown voltage
Journal
Micromachines
ISSN: 2072-666X
Titre abrégé: Micromachines (Basel)
Pays: Switzerland
ID NLM: 101640903
Informations de publication
Date de publication:
17 Jan 2020
17 Jan 2020
Historique:
received:
19
12
2019
revised:
10
01
2020
accepted:
12
01
2020
entrez:
23
1
2020
pubmed:
23
1
2020
medline:
23
1
2020
Statut:
epublish
Résumé
We investigated the origin of vertical leakage and breakdown in GaN-on-Si epitaxial structures. In order to understand the role of the nucleation layer, AlGaN buffer, and C-doped GaN, we designed a sequential growth experiment. Specifically, we analyzed three different structures grown on silicon substrates: AlN/Si, AlGaN/AlN/Si, C:GaN/AlGaN/AlN/Si. The results demonstrate that: (i) the AlN layer grown on silicon has a breakdown field of 3.25 MV/cm, which further decreases with temperature. This value is much lower than that of highly-crystalline AlN, and the difference can be ascribed to the high density of vertical leakage paths like V-pits or threading dislocations. (ii) the AlN/Si structures show negative charge trapping, due to the injection of electrons from silicon to deep traps in AlN. (iii) adding AlGaN on top of AlN significantly reduces the defect density, thus resulting in a more uniform sample-to-sample leakage. (iv) a substantial increase in breakdown voltage is obtained only in the C:GaN/AlGaN/AlN/Si structure, that allows it to reach V
Identifiants
pubmed: 31963553
pii: mi11010101
doi: 10.3390/mi11010101
pmc: PMC7019869
pii:
doi:
Types de publication
Journal Article
Langues
eng
Subventions
Organisme : H2020 European Research Council
ID : 720527