Self-assembly of highly sensitive 3D magnetic field vector angular encoders.


Journal

Science advances
ISSN: 2375-2548
Titre abrégé: Sci Adv
Pays: United States
ID NLM: 101653440

Informations de publication

Date de publication:
Dec 2019
Historique:
received: 16 07 2019
accepted: 28 10 2019
entrez: 18 2 2020
pubmed: 18 2 2020
medline: 18 2 2020
Statut: epublish

Résumé

Novel robotic, bioelectronic, and diagnostic systems require a variety of compact and high-performance sensors. Among them, compact three-dimensional (3D) vector angular encoders are required to determine spatial position and orientation in a 3D environment. However, fabrication of 3D vector sensors is a challenging task associated with time-consuming and expensive, sequential processing needed for the orientation of individual sensor elements in 3D space. In this work, we demonstrate the potential of 3D self-assembly to simultaneously reorient numerous giant magnetoresistive (GMR) spin valve sensors for smart fabrication of 3D magnetic angular encoders. During the self-assembly process, the GMR sensors are brought into their desired orthogonal positions within the three Cartesian planes in a simultaneous process that yields monolithic high-performance devices. We fabricated vector angular encoders with equivalent angular accuracy in all directions of 0.14°, as well as low noise and low power consumption during high-speed operation at frequencies up to 1 kHz.

Identifiants

pubmed: 32064322
doi: 10.1126/sciadv.aay7459
pii: aay7459
pmc: PMC6989305
doi:

Types de publication

Journal Article

Langues

eng

Sous-ensembles de citation

IM

Pagination

eaay7459

Informations de copyright

Copyright © 2019 The Authors, some rights reserved; exclusive licensee American Association for the Advancement of Science. No claim to original U.S. Government Works. Distributed under a Creative Commons Attribution NonCommercial License 4.0 (CC BY-NC).

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Auteurs

Christian Becker (C)

Institute for Integrative Nanosciences, Institute for Solid State and Materials Research Dresden (Leibniz IFW Dresden), 01069 Dresden, Germany.

Daniil Karnaushenko (D)

Institute for Integrative Nanosciences, Institute for Solid State and Materials Research Dresden (Leibniz IFW Dresden), 01069 Dresden, Germany.

Tong Kang (T)

Institute for Integrative Nanosciences, Institute for Solid State and Materials Research Dresden (Leibniz IFW Dresden), 01069 Dresden, Germany.

Dmitriy D Karnaushenko (DD)

Institute for Integrative Nanosciences, Institute for Solid State and Materials Research Dresden (Leibniz IFW Dresden), 01069 Dresden, Germany.

Maryam Faghih (M)

Institute for Integrative Nanosciences, Institute for Solid State and Materials Research Dresden (Leibniz IFW Dresden), 01069 Dresden, Germany.

Alaleh Mirhajivarzaneh (A)

Institute for Integrative Nanosciences, Institute for Solid State and Materials Research Dresden (Leibniz IFW Dresden), 01069 Dresden, Germany.

Oliver G Schmidt (OG)

Institute for Integrative Nanosciences, Institute for Solid State and Materials Research Dresden (Leibniz IFW Dresden), 01069 Dresden, Germany.
Material Systems for Nanoelectronics, Chemnitz University of Technology, 09107 Chemnitz, Germany.
Research Center for Materials, Architectures and Integration of Nanomembranes (MAIN), Rosenbergstraße 6, TU Chemnitz, 09126 Chemnitz, Germany.
Nanophysics, Faculty of Physics, TU Dresden, 01062 Dresden, Germany.

Classifications MeSH