Thermally Reduced Graphene Oxide/Carbon Nanotube Composite Films for Thermal Packaging Applications.

carbon nanotubes composite film graphene thermal interface materials

Journal

Materials (Basel, Switzerland)
ISSN: 1996-1944
Titre abrégé: Materials (Basel)
Pays: Switzerland
ID NLM: 101555929

Informations de publication

Date de publication:
10 Jan 2020
Historique:
received: 11 12 2019
revised: 05 01 2020
accepted: 07 01 2020
entrez: 15 4 2020
pubmed: 15 4 2020
medline: 15 4 2020
Statut: epublish

Résumé

Thermally reduced graphene oxide/carbon nanotube (rGO/CNT) composite films were successfully prepared by a high-temperature annealing process. Their microstructure, thermal conductivity and mechanical properties were systematically studied at different annealing temperatures. As the annealing temperature increased, more oxygen-containing functional groups were removed from the composite film, and the percentage of graphene continuously increased. When the annealing temperature increased from 1100 to 1400 °C, the thermal conductivity of the composite film also continuously increased from 673.9 to 1052.1 W m

Identifiants

pubmed: 32284495
pii: ma13020317
doi: 10.3390/ma13020317
pmc: PMC7014255
pii:
doi:

Types de publication

Journal Article

Langues

eng

Subventions

Organisme : Ministry of Science and Technology of the People's Republic of China
ID : 2017YFB0406000
Organisme : National Natural Science Foundation of China
ID : 61704102
Organisme : National Natural Science Foundation of China
ID : 51861135105

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Auteurs

Guang-Jie Yuan (GJ)

Shanghai Key Laboratory of Intelligent Manufacturing and Robotics, School of Automation and Mechanical Engineering, Shanghai University, Shanghai 200444, China.

Jie-Fei Xie (JF)

Sino-Sweden Microsystem Integration Technology (SMIT) Center, School of Automation and Mechanical Engineering, Shanghai University, Shanghai 201800, China.

Hao-Hao Li (HH)

Sino-Sweden Microsystem Integration Technology (SMIT) Center, School of Automation and Mechanical Engineering, Shanghai University, Shanghai 201800, China.

Bo Shan (B)

Sino-Sweden Microsystem Integration Technology (SMIT) Center, School of Automation and Mechanical Engineering, Shanghai University, Shanghai 201800, China.

Xiao-Xin Zhang (XX)

Sino-Sweden Microsystem Integration Technology (SMIT) Center, School of Automation and Mechanical Engineering, Shanghai University, Shanghai 201800, China.

Johan Liu (J)

Sino-Sweden Microsystem Integration Technology (SMIT) Center, School of Automation and Mechanical Engineering, Shanghai University, Shanghai 201800, China.
Electronics Materials and Systems Laboratory, Department of Microtechnology and Nanoscience (MC2), Chalmers University of Technology, SE-412 96 Goteborg, Sweden.

Long Li (L)

Shanghai Key Laboratory of Intelligent Manufacturing and Robotics, School of Automation and Mechanical Engineering, Shanghai University, Shanghai 200444, China.

Ying-Zhong Tian (YZ)

Shanghai Key Laboratory of Intelligent Manufacturing and Robotics, School of Automation and Mechanical Engineering, Shanghai University, Shanghai 200444, China.

Classifications MeSH