Microscopic sensors using optical wireless integrated circuits.
microfabrication
microscopic
sensor
Journal
Proceedings of the National Academy of Sciences of the United States of America
ISSN: 1091-6490
Titre abrégé: Proc Natl Acad Sci U S A
Pays: United States
ID NLM: 7505876
Informations de publication
Date de publication:
28 04 2020
28 04 2020
Historique:
pubmed:
19
4
2020
medline:
26
8
2020
entrez:
19
4
2020
Statut:
ppublish
Résumé
We present a platform for parallel production of standalone, untethered electronic sensors that are truly microscopic, i.e., smaller than the resolution of the naked eye. This platform heterogeneously integrates silicon electronics and inorganic microlight emitting diodes (LEDs) into a 100-μm-scale package that is powered by and communicates with light. The devices are fabricated, packaged, and released in parallel using photolithographic techniques, resulting in ∼10,000 individual sensors per square inch. To illustrate their use, we show proof-of-concept measurements recording voltage, temperature, pressure, and conductivity in a variety of environments.
Identifiants
pubmed: 32303653
pii: 1919677117
doi: 10.1073/pnas.1919677117
pmc: PMC7196798
doi:
Substances chimiques
Silicon
Z4152N8IUI
Types de publication
Journal Article
Research Support, N.I.H., Extramural
Research Support, Non-U.S. Gov't
Research Support, U.S. Gov't, Non-P.H.S.
Langues
eng
Sous-ensembles de citation
IM
Pagination
9173-9179Subventions
Organisme : NEI NIH HHS
ID : R21 EY027581
Pays : United States
Organisme : NINDS NIH HHS
ID : UF1 NS107687
Pays : United States
Déclaration de conflit d'intérêts
Competing interest statement: A.J.C, S.L., A.C.M., and P.L.M. have filed a Patent Cooperation Treaty application that covers the work reported here (Provisional Patent Application 62/740,326).
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