Point defect induced intervalley scattering for the enhancement of interlayer electron transport in bilayer MoS


Journal

Nanoscale
ISSN: 2040-3372
Titre abrégé: Nanoscale
Pays: England
ID NLM: 101525249

Informations de publication

Date de publication:
07 May 2020
Historique:
pubmed: 29 4 2020
medline: 29 4 2020
entrez: 29 4 2020
Statut: ppublish

Résumé

Since the emergence of transition metal dichalcogenide (TMDC) based van der Waals (vdW) structures, interlayer charge transport has become an important issue towards the application of these novel materials. Due to the unique layered structure of these materials, charge transport across the vdW gaps via tunneling is governed by individual valleys with different interlayer coupling strengths. On the other hand, the omnipresent point defects in TMDCs could possibly cause intervalley scattering between these valleys. In this article, we investigate the influence of point defect induced intervalley scattering on the interlayer charge transport of the MoS2 homojunction by first principles calculation. We find that S vacancies and Mo-S antisite defects enhance the electron interlayer transport by intervalley scattering that divert the electrons from the non-interlayer coupling K valley to the strong interlayer coupling Q valley. The interlayer charge transport enhancement caused by such an intervalley scattering mechanism could pave the way towards understanding the interlayer charge transport in TMDC based vdW structures.

Identifiants

pubmed: 32342960
doi: 10.1039/d0nr01339k
doi:

Types de publication

Journal Article

Langues

eng

Sous-ensembles de citation

IM

Pagination

9859-9865

Auteurs

Yang Ou (Y)

Beijing Advanced Innovation Center for Materials Genome Engineering, Beijing Key Laboratory for Advanced Energy Materials and Technologies, University of Science and Technology Beijing, Beijing 100083, People's Republic of China. zhangzheng@ustb.edu.cn yuezhang@ustb.edu.cn.

Zhuo Kang (Z)

Beijing Advanced Innovation Center for Materials Genome Engineering, Beijing Key Laboratory for Advanced Energy Materials and Technologies, University of Science and Technology Beijing, Beijing 100083, People's Republic of China. zhangzheng@ustb.edu.cn yuezhang@ustb.edu.cn and State Key Laboratory for Advanced Metals and Materials, School of Materials Science and Engineering, University of Science and Technology Beijing, Beijing 100083, People's Republic of China.

Qingliang Liao (Q)

Beijing Advanced Innovation Center for Materials Genome Engineering, Beijing Key Laboratory for Advanced Energy Materials and Technologies, University of Science and Technology Beijing, Beijing 100083, People's Republic of China. zhangzheng@ustb.edu.cn yuezhang@ustb.edu.cn and State Key Laboratory for Advanced Metals and Materials, School of Materials Science and Engineering, University of Science and Technology Beijing, Beijing 100083, People's Republic of China.

Shihan Gao (S)

Beijing Advanced Innovation Center for Materials Genome Engineering, Beijing Key Laboratory for Advanced Energy Materials and Technologies, University of Science and Technology Beijing, Beijing 100083, People's Republic of China. zhangzheng@ustb.edu.cn yuezhang@ustb.edu.cn.

Zheng Zhang (Z)

Beijing Advanced Innovation Center for Materials Genome Engineering, Beijing Key Laboratory for Advanced Energy Materials and Technologies, University of Science and Technology Beijing, Beijing 100083, People's Republic of China. zhangzheng@ustb.edu.cn yuezhang@ustb.edu.cn and State Key Laboratory for Advanced Metals and Materials, School of Materials Science and Engineering, University of Science and Technology Beijing, Beijing 100083, People's Republic of China.

Yue Zhang (Y)

Beijing Advanced Innovation Center for Materials Genome Engineering, Beijing Key Laboratory for Advanced Energy Materials and Technologies, University of Science and Technology Beijing, Beijing 100083, People's Republic of China. zhangzheng@ustb.edu.cn yuezhang@ustb.edu.cn and State Key Laboratory for Advanced Metals and Materials, School of Materials Science and Engineering, University of Science and Technology Beijing, Beijing 100083, People's Republic of China.

Classifications MeSH