Remarkable Effects of an Electrodeposited Copper Skin on the Strength and the Electrical and Thermal Conductivities of Reduced Graphene Oxide-Printed Scaffolds.
3D printing
Cu mesh
copper
electroplating
graphene oxide (GO)
heat dissipation
thermal interface material (TIM)
Journal
ACS applied materials & interfaces
ISSN: 1944-8252
Titre abrégé: ACS Appl Mater Interfaces
Pays: United States
ID NLM: 101504991
Informations de publication
Date de publication:
27 May 2020
27 May 2020
Historique:
pubmed:
6
5
2020
medline:
6
5
2020
entrez:
6
5
2020
Statut:
ppublish
Résumé
Architected Cu/reduced graphene oxide (rGO) heterostructures are achieved by electrodepositing copper on filament-printed rGO scaffolds. The Cu coating perfectly contours the printed rGO structure, but isolated Cu particles also permeate inside the filaments. Although the Cu deposition conveys a certain mass augment, the three-dimensional (3D) structures remain reasonably light (bulk density ≅ 0.42 g·cm
Identifiants
pubmed: 32368891
doi: 10.1021/acsami.0c01819
doi:
Types de publication
Journal Article
Langues
eng
Sous-ensembles de citation
IM