High-Temperature-Annealed Flexible Carbon Nanotube Network Transistors for High-Frequency Wearable Wireless Electronics.

carbon nanotube transistors flexible wearable electronics high-temperature anneal nanomembrane transfer technique radio-frequency integrated circuits wireless applications

Journal

ACS applied materials & interfaces
ISSN: 1944-8252
Titre abrégé: ACS Appl Mater Interfaces
Pays: United States
ID NLM: 101504991

Informations de publication

Date de publication:
10 Jun 2020
Historique:
pubmed: 16 5 2020
medline: 16 5 2020
entrez: 16 5 2020
Statut: ppublish

Résumé

Semiconducting single-walled carbon nanotubes (SWNTs) are potential active materials for fast-growing flexible/wearable applications with low-power dissipation, especially suitable for increasingly important radio-frequency (RF) wireless biosensor systems. However, the operation frequency of the existing flexible carbon nanotube field-effect transistors (CNT-FETs) is far below the current state-of-the-art GSM spectrum frequency band (typical 850 MHz) for near-field wireless communication applications. In this paper, we successfully conduct a 900 °C annealing process for the flexible CNT-FETs and hence significantly improve their operation frequency up to 2.1 gigahertz (GHz), making it possible to cover the current GSM spectra for integrated wireless sensor systems. The high-temperature annealing process significantly improves the electrical characteristic of the flexible CNT-FETs by removing the surfactant impurities of the SWNT materials. The obtained flexible CNT-FETs exhibit record transconductance (

Identifiants

pubmed: 32410452
doi: 10.1021/acsami.0c03810
doi:

Types de publication

Journal Article

Langues

eng

Sous-ensembles de citation

IM

Pagination

26145-26152

Auteurs

Yu Lan (Y)

School of Electrical Science and Engineering, University of Electronic Science and Technology of China, Chengdu, Sichuan 611731, P. R. China.
Department of Electrical and Computer Engineering, University of Wisconsin-Madison, Madison, Wisconsin 53705, United States.

Yang Yang (Y)

Science and Technology on Monolithic Integrated Circuits and Modules Laboratory, Nanjing Electronic Device Institute, Nanjing, Jiangsu 210016, P. R. China.

Yan Wang (Y)

School of Electrical Science and Engineering, University of Electronic Science and Technology of China, Chengdu, Sichuan 611731, P. R. China.

Yun Wu (Y)

Science and Technology on Monolithic Integrated Circuits and Modules Laboratory, Nanjing Electronic Device Institute, Nanjing, Jiangsu 210016, P. R. China.

Zhengyi Cao (Z)

Science and Technology on Monolithic Integrated Circuits and Modules Laboratory, Nanjing Electronic Device Institute, Nanjing, Jiangsu 210016, P. R. China.

Shuai Huo (S)

Science and Technology on Monolithic Integrated Circuits and Modules Laboratory, Nanjing Electronic Device Institute, Nanjing, Jiangsu 210016, P. R. China.

Lihong Jiang (L)

Science and Technology on Monolithic Integrated Circuits and Modules Laboratory, Nanjing Electronic Device Institute, Nanjing, Jiangsu 210016, P. R. China.

Yunchuan Guo (Y)

School of Electrical Science and Engineering, University of Electronic Science and Technology of China, Chengdu, Sichuan 611731, P. R. China.

Yunqiu Wu (Y)

School of Electrical Science and Engineering, University of Electronic Science and Technology of China, Chengdu, Sichuan 611731, P. R. China.

Bo Yan (B)

School of Electrical Science and Engineering, University of Electronic Science and Technology of China, Chengdu, Sichuan 611731, P. R. China.

Ruimin Xu (R)

School of Electrical Science and Engineering, University of Electronic Science and Technology of China, Chengdu, Sichuan 611731, P. R. China.

Yuanfu Chen (Y)

School of Electrical Science and Engineering, University of Electronic Science and Technology of China, Chengdu, Sichuan 611731, P. R. China.
Department of Physics, School of Science, Tibet University, Lhasa 850000, P. R. China.

Yanrong Li (Y)

School of Electrical Science and Engineering, University of Electronic Science and Technology of China, Chengdu, Sichuan 611731, P. R. China.

Shalini Lal (S)

Department of Electrical and Computer Engineering, University of Wisconsin-Madison, Madison, Wisconsin 53705, United States.

Zhenqiang Ma (Z)

Department of Electrical and Computer Engineering, University of Wisconsin-Madison, Madison, Wisconsin 53705, United States.

Yuehang Xu (Y)

School of Electrical Science and Engineering, University of Electronic Science and Technology of China, Chengdu, Sichuan 611731, P. R. China.

Classifications MeSH