Haptic-feedback smart glove as a creative human-machine interface (HMI) for virtual/augmented reality applications.


Journal

Science advances
ISSN: 2375-2548
Titre abrégé: Sci Adv
Pays: United States
ID NLM: 101653440

Informations de publication

Date de publication:
05 2020
Historique:
received: 16 10 2019
accepted: 26 02 2020
entrez: 5 6 2020
pubmed: 5 6 2020
medline: 5 6 2020
Statut: epublish

Résumé

Human-machine interfaces (HMIs) experience increasing requirements for intuitive and effective manipulation. Current commercialized solutions of glove-based HMI are limited by either detectable motions or the huge cost on fabrication, energy, and computing power. We propose the haptic-feedback smart glove with triboelectric-based finger bending sensors, palm sliding sensor, and piezoelectric mechanical stimulators. The detection of multidirectional bending and sliding events is demonstrated in virtual space using the self-generated triboelectric signals for various degrees of freedom on human hand. We also perform haptic mechanical stimulation via piezoelectric chips to realize the augmented HMI. The smart glove achieves object recognition using machine learning technique, with an accuracy of 96%. Through the integrated demonstration of multidimensional manipulation, haptic feedback, and AI-based object recognition, our glove reveals its potential as a promising solution for low-cost and advanced human-machine interaction, which can benefit diversified areas, including entertainment, home healthcare, sports training, and medical industry.

Identifiants

pubmed: 32494718
doi: 10.1126/sciadv.aaz8693
pii: aaz8693
pmc: PMC7209995
doi:

Types de publication

Journal Article

Langues

eng

Sous-ensembles de citation

IM

Pagination

eaaz8693

Informations de copyright

Copyright © 2020 The Authors, some rights reserved; exclusive licensee American Association for the Advancement of Science. No claim to original U.S. Government Works. Distributed under a Creative Commons Attribution NonCommercial License 4.0 (CC BY-NC).

Références

IEEE Trans Biomed Eng. 2004 Jun;51(6):1026-33
pubmed: 15188874
Nature. 2019 May;569(7758):698-702
pubmed: 31142856
Nature. 2019 Nov;575(7783):473-479
pubmed: 31748722
Adv Mater. 2018 Mar;30(12):e1706738
pubmed: 29411908
Adv Mater. 2017 Oct;29(39):
pubmed: 28833673
ACS Nano. 2016 Dec 27;10(12):10912-10920
pubmed: 28024389
Adv Sci (Weinh). 2019 May 29;6(15):1900617
pubmed: 31406673
Sci Adv. 2016 Nov 16;2(11):e1601185
pubmed: 28138529
Adv Mater. 2015 Mar 4;27(9):1561-6
pubmed: 25640804
Adv Mater. 2018 Mar;30(12):e1706299
pubmed: 29424032
Nat Nanotechnol. 2011 Oct 23;6(12):788-92
pubmed: 22020121
ACS Nano. 2019 Feb 26;13(2):1940-1952
pubmed: 30741521
Nat Nanotechnol. 2016 May;11(5):472-8
pubmed: 26809055
Nat Commun. 2018 Jan 16;9(1):244
pubmed: 29339793

Auteurs

Minglu Zhu (M)

Department of Electrical and Computer Engineering, National University of Singapore, 4 Engineering Drive 3, Singapore 117576, Singapore.
Center for Intelligent Sensors and MEMS (CISM), National University of Singapore, 5 Engineering Drive 1, Singapore 117608, Singapore.
Hybrid Integrated Flexible Electronic Systems (HIFES), 5 Engineering Drive 1, Singapore 117608, Singapore.
National University of Singapore Suzhou Research Institute (NUSRI), Suzhou Industrial Park, Suzhou 215123, China.

Zhongda Sun (Z)

Department of Electrical and Computer Engineering, National University of Singapore, 4 Engineering Drive 3, Singapore 117576, Singapore.
Center for Intelligent Sensors and MEMS (CISM), National University of Singapore, 5 Engineering Drive 1, Singapore 117608, Singapore.
Hybrid Integrated Flexible Electronic Systems (HIFES), 5 Engineering Drive 1, Singapore 117608, Singapore.

Zixuan Zhang (Z)

Department of Electrical and Computer Engineering, National University of Singapore, 4 Engineering Drive 3, Singapore 117576, Singapore.
Center for Intelligent Sensors and MEMS (CISM), National University of Singapore, 5 Engineering Drive 1, Singapore 117608, Singapore.
Hybrid Integrated Flexible Electronic Systems (HIFES), 5 Engineering Drive 1, Singapore 117608, Singapore.

Qiongfeng Shi (Q)

Department of Electrical and Computer Engineering, National University of Singapore, 4 Engineering Drive 3, Singapore 117576, Singapore.
Center for Intelligent Sensors and MEMS (CISM), National University of Singapore, 5 Engineering Drive 1, Singapore 117608, Singapore.
Hybrid Integrated Flexible Electronic Systems (HIFES), 5 Engineering Drive 1, Singapore 117608, Singapore.

Tianyiyi He (T)

Department of Electrical and Computer Engineering, National University of Singapore, 4 Engineering Drive 3, Singapore 117576, Singapore.
Center for Intelligent Sensors and MEMS (CISM), National University of Singapore, 5 Engineering Drive 1, Singapore 117608, Singapore.
Hybrid Integrated Flexible Electronic Systems (HIFES), 5 Engineering Drive 1, Singapore 117608, Singapore.
National University of Singapore Suzhou Research Institute (NUSRI), Suzhou Industrial Park, Suzhou 215123, China.

Huicong Liu (H)

Jiangsu Provincial Key Laboratory of Advanced Robotics, School of Mechanical and Electric Engineering, Soochow University, Suzhou 215123, China.

Tao Chen (T)

Jiangsu Provincial Key Laboratory of Advanced Robotics, School of Mechanical and Electric Engineering, Soochow University, Suzhou 215123, China.

Chengkuo Lee (C)

Department of Electrical and Computer Engineering, National University of Singapore, 4 Engineering Drive 3, Singapore 117576, Singapore.
Center for Intelligent Sensors and MEMS (CISM), National University of Singapore, 5 Engineering Drive 1, Singapore 117608, Singapore.
Hybrid Integrated Flexible Electronic Systems (HIFES), 5 Engineering Drive 1, Singapore 117608, Singapore.
National University of Singapore Suzhou Research Institute (NUSRI), Suzhou Industrial Park, Suzhou 215123, China.
NUS Graduate School for Integrative Sciences and Engineering, National University of Singapore, Singapore 119077, Singapore.

Classifications MeSH