Copper Electrodeposition from Deep Eutectic Solvents-Voltammetric Studies Providing Insights into the Role of Substrate: Platinum vs Glassy Carbon.
Journal
The journal of physical chemistry. B
ISSN: 1520-5207
Titre abrégé: J Phys Chem B
Pays: United States
ID NLM: 101157530
Informations de publication
Date de publication:
02 07 2020
02 07 2020
Historique:
pubmed:
5
6
2020
medline:
5
6
2020
entrez:
5
6
2020
Statut:
ppublish
Résumé
We report on the effect of the substrate on electrochemical deposition of Cu from deep eutectic solvent ethaline. We investigated the polarization behavior during electrodeposition of Cu on Pt and glassy carbon (GC) from both Cu
Identifiants
pubmed: 32497430
doi: 10.1021/acs.jpcb.0c02735
doi:
Types de publication
Journal Article
Research Support, U.S. Gov't, Non-P.H.S.
Langues
eng
Sous-ensembles de citation
IM