Wearable breath monitoring via a hot-film/calorimetric airflow sensing system.

Breath monitoring Calorimetric sensor Hot-film senor Mobile health

Journal

Biosensors & bioelectronics
ISSN: 1873-4235
Titre abrégé: Biosens Bioelectron
Pays: England
ID NLM: 9001289

Informations de publication

Date de publication:
01 Sep 2020
Historique:
received: 05 03 2020
revised: 24 04 2020
accepted: 08 05 2020
entrez: 23 6 2020
pubmed: 23 6 2020
medline: 15 5 2021
Statut: ppublish

Résumé

Monitoring the breath information from two nostrils can detect breath-related health problems. In this work, we introduce a wearable hot-film/calorimetric breath sensing system composed of a hot-film senor in the center and two calorimetric sensors on two sides. This design has the advantages of low power consumption of 60 mW and good sensitivity to simultaneously measure the mix breath velocity and individual breath airflow signals from the two nostrils. In prototype demonstrations, abnormal breath conditions (apnea, hypopnea, polypnea) and the asymmetric breath conditions between the right and left nostril have been recorded and analyzed for potential usages in the diagnosis of specific breath-related diseases.

Identifiants

pubmed: 32568695
pii: S0956-5663(20)30283-9
doi: 10.1016/j.bios.2020.112288
pii:
doi:

Types de publication

Journal Article

Langues

eng

Sous-ensembles de citation

IM

Pagination

112288

Informations de copyright

Copyright © 2020 Elsevier B.V. All rights reserved.

Déclaration de conflit d'intérêts

Declaration of competing interest The authors declare that they have no known competing financial interests or personal relationships that could have appeared to influence the work reported in this paper.

Auteurs

Tao Jiang (T)

Sensors and Microsystems Laboratory, Tsinghua-Berkeley Shenzhen Institute, Tsinghua University, Shenzhen, 518055, China; Berkeley Sensor & Actuator Center, University of California Berkeley, Berkeley, CA, 94720, USA; Mechanical Engineering Department, University of California Berkeley, Berkeley, CA, 94720, USA; Tsinghua-Shenzhen International Graduate School, Tsinghua University, Shenzhen, 518055, China.

Lirong Deng (L)

Shenzhen Environmental Science and New Energy Technology Engineering Laboratory, Tsinghua-Berkeley Shenzhen Institute, Tsinghua University, Shenzhen, 518055, China.

Wenying Qiu (W)

Sensors and Microsystems Laboratory, Tsinghua-Berkeley Shenzhen Institute, Tsinghua University, Shenzhen, 518055, China; Berkeley Sensor & Actuator Center, University of California Berkeley, Berkeley, CA, 94720, USA; Mechanical Engineering Department, University of California Berkeley, Berkeley, CA, 94720, USA; Tsinghua-Shenzhen International Graduate School, Tsinghua University, Shenzhen, 518055, China.

Jiaming Liang (J)

Sensors and Microsystems Laboratory, Tsinghua-Berkeley Shenzhen Institute, Tsinghua University, Shenzhen, 518055, China; Berkeley Sensor & Actuator Center, University of California Berkeley, Berkeley, CA, 94720, USA; Mechanical Engineering Department, University of California Berkeley, Berkeley, CA, 94720, USA.

Yichuan Wu (Y)

School of Mechanical and Electrical Engineering, University of Electronic Science and Technology of China, Chengdu, 611731, China.

Zhichun Shao (Z)

Berkeley Sensor & Actuator Center, University of California Berkeley, Berkeley, CA, 94720, USA; Mechanical Engineering Department, University of California Berkeley, Berkeley, CA, 94720, USA.

Dongkai Wang (D)

Sensors and Microsystems Laboratory, Tsinghua-Berkeley Shenzhen Institute, Tsinghua University, Shenzhen, 518055, China; Berkeley Sensor & Actuator Center, University of California Berkeley, Berkeley, CA, 94720, USA; Mechanical Engineering Department, University of California Berkeley, Berkeley, CA, 94720, USA.

Min Zhang (M)

Tsinghua-Shenzhen International Graduate School, Tsinghua University, Shenzhen, 518055, China.

Xiang Qian (X)

Tsinghua-Shenzhen International Graduate School, Tsinghua University, Shenzhen, 518055, China. Electronic address: qian.xiang@sz.tsinghua.edu.cn.

Junwen Zhong (J)

Berkeley Sensor & Actuator Center, University of California Berkeley, Berkeley, CA, 94720, USA; Mechanical Engineering Department, University of California Berkeley, Berkeley, CA, 94720, USA; Department of Electromechanical Engineering, University of Macau, Macao, 999078, China. Electronic address: junwenzhong@um.edu.mo.

Xiaohao Wang (X)

Sensors and Microsystems Laboratory, Tsinghua-Berkeley Shenzhen Institute, Tsinghua University, Shenzhen, 518055, China; Tsinghua-Shenzhen International Graduate School, Tsinghua University, Shenzhen, 518055, China.

Liwei Lin (L)

Sensors and Microsystems Laboratory, Tsinghua-Berkeley Shenzhen Institute, Tsinghua University, Shenzhen, 518055, China; Berkeley Sensor & Actuator Center, University of California Berkeley, Berkeley, CA, 94720, USA; Mechanical Engineering Department, University of California Berkeley, Berkeley, CA, 94720, USA. Electronic address: lwlin@berkeley.edu.

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Classifications MeSH