A Thermal Radiation Modulation Platform by Emissivity Engineering with Graded Metal-Insulator Transition.

emissivity engineering infrared camouflage materials platforms metal-insulator transition thermal radiation

Journal

Advanced materials (Deerfield Beach, Fla.)
ISSN: 1521-4095
Titre abrégé: Adv Mater
Pays: Germany
ID NLM: 9885358

Informations de publication

Date de publication:
Sep 2020
Historique:
received: 29 10 2019
revised: 29 01 2020
accepted: 25 02 2020
pubmed: 24 7 2020
medline: 24 7 2020
entrez: 24 7 2020
Statut: ppublish

Résumé

Thermal radiation from a black body increases with the fourth power of absolute temperature (T

Identifiants

pubmed: 32700403
doi: 10.1002/adma.201907071
doi:

Types de publication

Journal Article

Langues

eng

Sous-ensembles de citation

IM

Pagination

e1907071

Subventions

Organisme : NSF
ID : DMR-1608899
Organisme : NSF
ID : 1555336
Organisme : Office of Science
Organisme : Basic Energy Sciences
Organisme : Materials Sciences and Engineering Division
Organisme : U.S. Department of Energy
ID : DE-AC02-05CH11231
Organisme : A*STAR
ID : 1527000014
Organisme : A*STAR
ID : R-263-000-B91-305

Informations de copyright

© 2020 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.

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Auteurs

Kechao Tang (K)

Department of Materials Science and Engineering, University of California, Berkeley, CA, 94720, USA.
Division of Materials Sciences, Lawrence Berkeley National Laboratory, Berkeley, CA, 94720, USA.

Xi Wang (X)

Department of Materials Science and Engineering, University of California, Berkeley, CA, 94720, USA.

Kaichen Dong (K)

Department of Materials Science and Engineering, University of California, Berkeley, CA, 94720, USA.

Ying Li (Y)

Department of Electrical and Computer Engineering, National University of Singapore, Singapore, 117583, Singapore.

Jiachen Li (J)

Department of Materials Science and Engineering, University of California, Berkeley, CA, 94720, USA.

Bo Sun (B)

Tsinghua-Berkeley Shenzhen Institute, Tsinghua University, Shenzhen, 518055, China.

Xiang Zhang (X)

Division of Materials Sciences, Lawrence Berkeley National Laboratory, Berkeley, CA, 94720, USA.
NSF Nanoscale Science and Engineering Center (NSEC), University of California, Berkeley, CA, 94720, USA.
University of Hong Kong, Hong Kong, China.

Chris Dames (C)

Department of Mechanical Engineering, University of California, Berkeley, CA, 94720, USA.

Chengwei Qiu (C)

Department of Electrical and Computer Engineering, National University of Singapore, Singapore, 117583, Singapore.

Jie Yao (J)

Department of Materials Science and Engineering, University of California, Berkeley, CA, 94720, USA.
Division of Materials Sciences, Lawrence Berkeley National Laboratory, Berkeley, CA, 94720, USA.

Junqiao Wu (J)

Department of Materials Science and Engineering, University of California, Berkeley, CA, 94720, USA.
Division of Materials Sciences, Lawrence Berkeley National Laboratory, Berkeley, CA, 94720, USA.

Classifications MeSH