Catheter-integrated soft multilayer electronic arrays for multiplexed sensing and actuation during cardiac surgery.


Journal

Nature biomedical engineering
ISSN: 2157-846X
Titre abrégé: Nat Biomed Eng
Pays: England
ID NLM: 101696896

Informations de publication

Date de publication:
10 2020
Historique:
received: 26 03 2020
accepted: 17 07 2020
pubmed: 9 9 2020
medline: 31 12 2020
entrez: 8 9 2020
Statut: ppublish

Résumé

The rigidity and relatively primitive modes of operation of catheters equipped with sensing or actuation elements impede their conformal contact with soft-tissue surfaces, limit the scope of their uses, lengthen surgical times and increase the need for advanced surgical skills. Here, we report materials, device designs and fabrication approaches for integrating advanced electronic functionality with catheters for minimally invasive forms of cardiac surgery. By using multiphysics modelling, plastic heart models and Langendorff animal and human hearts, we show that soft electronic arrays in multilayer configurations on endocardial balloon catheters can establish conformal contact with curved tissue surfaces, support high-density spatiotemporal mapping of temperature, pressure and electrophysiological parameters and allow for programmable electrical stimulation, radiofrequency ablation and irreversible electroporation. Integrating multimodal and multiplexing capabilities into minimally invasive surgical instruments may improve surgical performance and patient outcomes.

Identifiants

pubmed: 32895515
doi: 10.1038/s41551-020-00604-w
pii: 10.1038/s41551-020-00604-w
pmc: PMC8021456
mid: NIHMS1684044
doi:

Banques de données

figshare
['10.6084/m9.figshare.12631835']

Types de publication

Journal Article Research Support, N.I.H., Extramural Research Support, Non-U.S. Gov't Research Support, U.S. Gov't, Non-P.H.S.

Langues

eng

Sous-ensembles de citation

IM

Pagination

997-1009

Subventions

Organisme : NHLBI NIH HHS
ID : K99 HL148523
Pays : United States
Organisme : NIGMS NIH HHS
ID : P41 GM103545
Pays : United States
Organisme : NHLBI NIH HHS
ID : R01 HL141470
Pays : United States
Organisme : NIGMS NIH HHS
ID : R24 GM136986
Pays : United States

Commentaires et corrections

Type : CommentIn

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Auteurs

Mengdi Han (M)

Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA.

Lin Chen (L)

Departments of Civil and Environmental Engineering, Northwestern University, Evanston, IL, USA.
State Key Laboratory for Mechanical Behavior of Materials, School of Materials Science and Engineering, Xi'an Jiaotong University, Xi'an, China.

Kedar Aras (K)

Department of Biomedical Engineering, The George Washington University, Washington, DC, USA.

Cunman Liang (C)

Key Laboratory of Mechanism Theory and Equipment Design of Ministry of Education, School of Mechanical Engineering, Tianjin University, Tianjin, China.

Xuexian Chen (X)

Academy for Advanced Interdisciplinary Studies, Peking University, Beijing, China.

Hangbo Zhao (H)

Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA.
Department of Aerospace and Mechanical Engineering, University of Southern California, Los Angeles, CA, USA.

Kan Li (K)

Departments of Civil and Environmental Engineering, Northwestern University, Evanston, IL, USA.
Department of Mechanical Engineering, Northwestern University, Evanston, IL, USA.
Department of Materials Science and Engineering, Northwestern University, Evanston, IL, USA.
Department of Engineering, University of Cambridge, Cambridge, UK.

Ndeye Rokhaya Faye (NR)

Department of Biomedical Engineering, The George Washington University, Washington, DC, USA.

Bohan Sun (B)

Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA.
Department of Mechanical Engineering, Johns Hopkins University, Baltimore, MD, USA.

Jae-Hwan Kim (JH)

Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign Urbana, Champaign, IL, USA.
Department of Electrical and Computer Engineering, University of Illinois at Urbana-Champaign Urbana, Champaign, IL, USA.

Wubin Bai (W)

Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA.
Department of Materials Science and Engineering, Northwestern University, Evanston, IL, USA.

Quansan Yang (Q)

Department of Mechanical Engineering, Northwestern University, Evanston, IL, USA.

Yuhang Ma (Y)

Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA.
School of Chemical Engineering and Technology, Tianjin University, Tianjin, China.

Wei Lu (W)

Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA.

Enming Song (E)

Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA.

Janice Mihyun Baek (JM)

Department of Chemistry, University of Illinois at Urbana-Champaign Urbana, Champaign, IL, USA.

Yujin Lee (Y)

Department of Chemistry, University of Illinois at Urbana-Champaign Urbana, Champaign, IL, USA.

Clifford Liu (C)

Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA.

Jeffrey B Model (JB)

Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA.

Guanjun Yang (G)

State Key Laboratory for Mechanical Behavior of Materials, School of Materials Science and Engineering, Xi'an Jiaotong University, Xi'an, China.

Roozbeh Ghaffari (R)

Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA.
Department of Biomedical Engineering, Northwestern University, Evanston, IL, USA.

Yonggang Huang (Y)

Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA. y-huang@northwestern.edu.
Departments of Civil and Environmental Engineering, Northwestern University, Evanston, IL, USA. y-huang@northwestern.edu.
Department of Mechanical Engineering, Northwestern University, Evanston, IL, USA. y-huang@northwestern.edu.
Department of Materials Science and Engineering, Northwestern University, Evanston, IL, USA. y-huang@northwestern.edu.

Igor R Efimov (IR)

Department of Biomedical Engineering, The George Washington University, Washington, DC, USA. efimov@gwu.edu.

John A Rogers (JA)

Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA. jrogers@northwestern.edu.
Department of Mechanical Engineering, Northwestern University, Evanston, IL, USA. jrogers@northwestern.edu.
Department of Materials Science and Engineering, Northwestern University, Evanston, IL, USA. jrogers@northwestern.edu.
Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign Urbana, Champaign, IL, USA. jrogers@northwestern.edu.
Department of Biomedical Engineering, Northwestern University, Evanston, IL, USA. jrogers@northwestern.edu.
Department of Surgery, Northwestern University Feinberg School of Medicine, Chicago, IL, USA. jrogers@northwestern.edu.
Department of Chemistry, Northwestern University, Evanston, IL, USA. jrogers@northwestern.edu.
Department of Electrical Engineering and Computer Science, Northwestern University, Evanston, IL, USA. jrogers@northwestern.edu.

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