Stress and Microstructure Evolution in Mo Thin Films without or with Cover Layers during Thermal-Cycling.
high-temperature behavior
intrinsic stress
molybdenum thin films
Journal
Materials (Basel, Switzerland)
ISSN: 1996-1944
Titre abrégé: Materials (Basel)
Pays: Switzerland
ID NLM: 101555929
Informations de publication
Date de publication:
04 Sep 2020
04 Sep 2020
Historique:
received:
14
08
2020
revised:
01
09
2020
accepted:
02
09
2020
entrez:
9
9
2020
pubmed:
10
9
2020
medline:
10
9
2020
Statut:
epublish
Résumé
The intrinsic stress behavior and microstructure evolution of Molybdenum thin films were investigated to evaluate their applicability as a metallization in high temperature microelectronic devices. For this purpose, 100 nm thick Mo films were sputter-deposited without or with an AlN or SiO
Identifiants
pubmed: 32899878
pii: ma13183926
doi: 10.3390/ma13183926
pmc: PMC7559374
pii:
doi:
Types de publication
Journal Article
Langues
eng
Subventions
Organisme : Bundesministerium für Wirtschaft und Technologie
ID : 03ET1589 A
Références
Materials (Basel). 2017 Mar 10;10(3):
pubmed: 28772637
IEEE Trans Ultrason Ferroelectr Freq Control. 2005 Apr;52(4):545-9
pubmed: 16060501
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pubmed: 31438479
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