Wearable Circuits Sintered at Room Temperature Directly on the Skin Surface for Health Monitoring.


Journal

ACS applied materials & interfaces
ISSN: 1944-8252
Titre abrégé: ACS Appl Mater Interfaces
Pays: United States
ID NLM: 101504991

Informations de publication

Date de publication:
07 Oct 2020
Historique:
pubmed: 12 9 2020
medline: 11 3 2021
entrez: 11 9 2020
Statut: ppublish

Résumé

A soft body area sensor network presents a promising direction in wearable devices to integrate on-body sensors for physiological signal monitoring and flexible printed circuit boards (FPCBs) for signal conditioning/readout and wireless transmission. However, its realization currently relies on various sophisticated fabrication approaches such as lithography or direct printing on a carrier substrate before attaching to the body. Here, we report a universal fabrication scheme to enable printing and room-temperature sintering of the metal nanoparticle on paper/fabric for FPCBs and directly on the human skin for on-body sensors with a novel sintering aid layer. Consisting of polyvinyl alcohol (PVA) paste and nanoadditives in the water, the sintering aid layer reduces the sintering temperature. Together with the significantly decreased surface roughness, it allows for the integration of a submicron-thick conductive pattern with enhanced electromechanical performance. Various on-body sensors integrated with an FPCB to detect health conditions illustrate a system-level example.

Identifiants

pubmed: 32911929
doi: 10.1021/acsami.0c11479
doi:

Substances chimiques

Silver 3M4G523W1G
Nickel 7OV03QG267

Types de publication

Journal Article

Langues

eng

Sous-ensembles de citation

IM

Pagination

45504-45515

Auteurs

Ling Zhang (L)

State Key Laboratory of Advanced Welding & Joining, Harbin Institute of Technology, Shenzhen 518055, People's Republic of China.
Flexible Printed Electronics Technology Center, Harbin Institute of Technology, Shenzhen 518055, People's Republic of China.
Department of Engineering Science and Mechanics, The Pennsylvania State University, University Park, Pennsylvania 16802, United States.

Hongjun Ji (H)

State Key Laboratory of Advanced Welding & Joining, Harbin Institute of Technology, Shenzhen 518055, People's Republic of China.
Flexible Printed Electronics Technology Center, Harbin Institute of Technology, Shenzhen 518055, People's Republic of China.
The School of Material Science and Engineering, Harbin Institute of Technology, Shenzhen 518055, People's Republic of China.

Houbing Huang (H)

Advanced Research Institute of Multidisciplinary Science, Beijing Institute of Technology, Beijing 100081, China.

Ning Yi (N)

Department of Materials Science and Engineering, The Pennsylvania State University, University Park, Pennsylvania 16802, United States.

Xiaoming Shi (X)

Advanced Research Institute of Multidisciplinary Science, Beijing Institute of Technology, Beijing 100081, China.

Senpei Xie (S)

Flexible Printed Electronics Technology Center, Harbin Institute of Technology, Shenzhen 518055, People's Republic of China.
The School of Material Science and Engineering, Harbin Institute of Technology, Shenzhen 518055, People's Republic of China.

Yaoyin Li (Y)

Flexible Printed Electronics Technology Center, Harbin Institute of Technology, Shenzhen 518055, People's Republic of China.
The School of Material Science and Engineering, Harbin Institute of Technology, Shenzhen 518055, People's Republic of China.

Ziheng Ye (Z)

The School of Material Science and Engineering, Harbin Institute of Technology, Shenzhen 518055, People's Republic of China.

Pengdong Feng (P)

Flexible Printed Electronics Technology Center, Harbin Institute of Technology, Shenzhen 518055, People's Republic of China.
The School of Material Science and Engineering, Harbin Institute of Technology, Shenzhen 518055, People's Republic of China.

Tiesong Lin (T)

State Key Laboratory of Advanced Welding & Joining, Harbin Institute of Technology, Shenzhen 518055, People's Republic of China.

Xiangli Liu (X)

The School of Material Science and Engineering, Harbin Institute of Technology, Shenzhen 518055, People's Republic of China.

Xuesong Leng (X)

State Key Laboratory of Advanced Welding & Joining, Harbin Institute of Technology, Shenzhen 518055, People's Republic of China.

Mingyu Li (M)

State Key Laboratory of Advanced Welding & Joining, Harbin Institute of Technology, Shenzhen 518055, People's Republic of China.
Flexible Printed Electronics Technology Center, Harbin Institute of Technology, Shenzhen 518055, People's Republic of China.
The School of Material Science and Engineering, Harbin Institute of Technology, Shenzhen 518055, People's Republic of China.

Jiaheng Zhang (J)

State Key Laboratory of Advanced Welding & Joining, Harbin Institute of Technology, Shenzhen 518055, People's Republic of China.
Flexible Printed Electronics Technology Center, Harbin Institute of Technology, Shenzhen 518055, People's Republic of China.
The School of Material Science and Engineering, Harbin Institute of Technology, Shenzhen 518055, People's Republic of China.

Xing Ma (X)

State Key Laboratory of Advanced Welding & Joining, Harbin Institute of Technology, Shenzhen 518055, People's Republic of China.
Flexible Printed Electronics Technology Center, Harbin Institute of Technology, Shenzhen 518055, People's Republic of China.
The School of Material Science and Engineering, Harbin Institute of Technology, Shenzhen 518055, People's Republic of China.

Peng He (P)

State Key Laboratory of Advanced Welding & Joining, Harbin Institute of Technology, Shenzhen 518055, People's Republic of China.

Weiwei Zhao (W)

State Key Laboratory of Advanced Welding & Joining, Harbin Institute of Technology, Shenzhen 518055, People's Republic of China.
Flexible Printed Electronics Technology Center, Harbin Institute of Technology, Shenzhen 518055, People's Republic of China.
The School of Material Science and Engineering, Harbin Institute of Technology, Shenzhen 518055, People's Republic of China.

Huanyu Cheng (H)

Department of Engineering Science and Mechanics, The Pennsylvania State University, University Park, Pennsylvania 16802, United States.
Department of Materials Science and Engineering, The Pennsylvania State University, University Park, Pennsylvania 16802, United States.

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