Microstructure-Based Fiber-To-Chip Coupling of Polymer Planar Bragg Gratings for Harsh Environment Applications.

Bragg grating sensors cyclic olefin copolymers fiber-to-chip coupling micromilling microstructures

Journal

Sensors (Basel, Switzerland)
ISSN: 1424-8220
Titre abrégé: Sensors (Basel)
Pays: Switzerland
ID NLM: 101204366

Informations de publication

Date de publication:
23 Sep 2020
Historique:
received: 19 08 2020
revised: 19 09 2020
accepted: 21 09 2020
entrez: 26 9 2020
pubmed: 27 9 2020
medline: 27 9 2020
Statut: epublish

Résumé

This article proposes and demonstrates a robust microstructure-based fiber-to-chip coupling scheme for planar Bragg grating devices. A polymer planar Bragg grating substrate is manufactured and microstructured by means of a micromilling process, while the respective photonic structures are generated by employing a sophisticated single-writing UV-exposure method. A stripped standard single mode fiber is inserted into the microstructure, which is filled with a UV-curable adhesive, and aligned with the integrated waveguide. After curing, final sensor assembly and thermal treatment, the proposed coupling scheme is capable of withstanding pressures up to 10 bar, at room temperature, and pressures up to 7.5 bar at an elevated temperature of 120 °C. Additionally, the coupling scheme is exceedingly robust towards tensile forces, limited only by the tensile strength of the employed single mode fiber. Due to its outstanding robustness, the coupling scheme enables the application of planar Bragg grating devices in harsh environments. This fact is underlined by integrating a microstructure-coupled photonic device into the center of a commercial-grade carbon fiber-reinforced polymer specimen. After its integration, the polymer-based Bragg grating sensor still exhibits a reflection peak with a dynamic range of 24 dB, and can thus be employed for sensing purposes.

Identifiants

pubmed: 32977452
pii: s20195452
doi: 10.3390/s20195452
pmc: PMC7583050
pii:
doi:

Types de publication

Journal Article

Langues

eng

Sous-ensembles de citation

IM

Subventions

Organisme : VDI/VDE-IT on behalf of the Bavarian Ministry of Economic Affairs, Regional Development and Energy
ID : ESB-1701-0005// ESB014/001

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Auteurs

Stefan Kefer (S)

Applied Laser and Photonics Group, Aschaffenburg University of Applied Sciences, Wuerzburger Strasse 45, 63743 Aschaffenburg, Germany.

Theresia Sauer (T)

Laboratory for Packaging and Interconnection Technology, Aschaffenburg University of Applied Sciences, Wuerzburger Strasse 45, 63743 Aschaffenburg, Germany.

Steffen Hessler (S)

Applied Laser and Photonics Group, Aschaffenburg University of Applied Sciences, Wuerzburger Strasse 45, 63743 Aschaffenburg, Germany.

Michael Kaloudis (M)

Laboratory for Packaging and Interconnection Technology, Aschaffenburg University of Applied Sciences, Wuerzburger Strasse 45, 63743 Aschaffenburg, Germany.

Ralf Hellmann (R)

Applied Laser and Photonics Group, Aschaffenburg University of Applied Sciences, Wuerzburger Strasse 45, 63743 Aschaffenburg, Germany.

Classifications MeSH