The dependence of the boson peak on the thickness of Cu


Journal

Physical chemistry chemical physics : PCCP
ISSN: 1463-9084
Titre abrégé: Phys Chem Chem Phys
Pays: England
ID NLM: 100888160

Informations de publication

Date de publication:
21 Jan 2021
Historique:
pubmed: 6 1 2021
medline: 6 1 2021
entrez: 5 1 2021
Statut: ppublish

Résumé

In this study, intensive calculations were performed to investigate the behavior of the low-temperature excess heat capacity of Cu50Zr50 ultrathin film metallic glasses. Our results show that there is a well-defined boson peak in the film metallic glasses and that the boson peak height exhibits an obvious size-dependent feature. Furthermore, there is a critical thickness dc in the curves between the boson peak height and the thickness, where the boson peak height changes abruptly. Through structural analysis, we found that the low-temperature excess heat capacity of the film metallic glasses is correlated with the density layering structure near the surface. The structural parameter S is defined by atomic density and it was found that the boson peak height is highly correlated with S. Our investigation of ultrathin film metallic glasses provides a deeper understanding about the structural origin of the boson peak in metallic glasses.

Identifiants

pubmed: 33399595
doi: 10.1039/d0cp05327a
doi:

Types de publication

Journal Article

Langues

eng

Sous-ensembles de citation

IM

Pagination

982-989

Auteurs

Dongdong Li (D)

Engineering Research Center of High Performance Copper Alloy Materials and Processing, Ministry of Education, Hefei University of Technology, Hefei 230009, China. rlzhou@hfut.edu.cn bo.zhang@hfut.edu.cn and School of Materials Science and Engineering, Hefei University of Technology, Hefei 230009, China.

Heng Chen (H)

School of Electronic Science & Applied Physics, Hefei University of Technology, Hefei 230009, China.

Bingyan Qu (B)

Engineering Research Center of High Performance Copper Alloy Materials and Processing, Ministry of Education, Hefei University of Technology, Hefei 230009, China. rlzhou@hfut.edu.cn bo.zhang@hfut.edu.cn and School of Materials Science and Engineering, Hefei University of Technology, Hefei 230009, China.

Fabao Zhang (F)

Engineering Research Center of High Performance Copper Alloy Materials and Processing, Ministry of Education, Hefei University of Technology, Hefei 230009, China. rlzhou@hfut.edu.cn bo.zhang@hfut.edu.cn and School of Materials Science and Engineering, Hefei University of Technology, Hefei 230009, China.

Rulong Zhou (R)

Engineering Research Center of High Performance Copper Alloy Materials and Processing, Ministry of Education, Hefei University of Technology, Hefei 230009, China. rlzhou@hfut.edu.cn bo.zhang@hfut.edu.cn and School of Materials Science and Engineering, Hefei University of Technology, Hefei 230009, China.

Bo Zhang (B)

Engineering Research Center of High Performance Copper Alloy Materials and Processing, Ministry of Education, Hefei University of Technology, Hefei 230009, China. rlzhou@hfut.edu.cn bo.zhang@hfut.edu.cn and School of Materials Science and Engineering, Hefei University of Technology, Hefei 230009, China.

Classifications MeSH