3D Printed Flexible Strain Sensors: From Printing to Devices and Signals.

3D printing Digital Light Processing direct ink writing flexible electronics fused deposition modeling strain sensors

Journal

Advanced materials (Deerfield Beach, Fla.)
ISSN: 1521-4095
Titre abrégé: Adv Mater
Pays: Germany
ID NLM: 9885358

Informations de publication

Date de publication:
Feb 2021
Historique:
received: 13 07 2020
revised: 23 08 2020
pubmed: 16 1 2021
medline: 16 1 2021
entrez: 15 1 2021
Statut: ppublish

Résumé

The revolutionary and pioneering advancements of flexible electronics provide the boundless potential to become one of the leading trends in the exploitation of wearable devices and electronic skin. Working as substantial intermediates for the collection of external mechanical signals, flexible strain sensors that get intensive attention are regarded as indispensable components in flexible integrated electronic systems. Compared with conventional preparation methods including complicated lithography and transfer printing, 3D printing technology is utilized to manufacture various flexible strain sensors owing to the low processing cost, superior fabrication accuracy, and satisfactory production efficiency. Herein, up-to-date flexible strain sensors fabricated via 3D printing are highlighted, focusing on different printing methods based on photocuring and materials extrusion, including Digital Light Processing (DLP), fused deposition modeling (FDM), and direct ink writing (DIW). Sensing mechanisms of 3D printed strain sensors are also discussed. Furthermore, the existing bottlenecks and future prospects are provided for further progressing research.

Identifiants

pubmed: 33448066
doi: 10.1002/adma.202004782
doi:

Types de publication

Journal Article Review

Langues

eng

Sous-ensembles de citation

IM

Pagination

e2004782

Subventions

Organisme : National Natural Science Foundation of China
ID : 51872139
Organisme : National Natural Science Foundation of China
ID : 61935017
Organisme : Projects of International Cooperation and Exchanges NSFC
ID : 51811530018
Organisme : NSF of Jiangsu Province
ID : BK20170045
Organisme : Recruitment Program of Global Experts
ID : 1211019
Organisme : "Six Talent Peak" Project of Jiangsu Province
ID : XCL-043
Organisme : Fundamental Research Funds for the Central Universities
Organisme : Natural Science Basic Research Program of Shaanxi
ID : 2019JLM-28
Organisme : Natural Science Foundation of Shaanxi Provincial Department of Education
ID : 2019JLM-28
Organisme : Six Talent Peaks Project in Jiangsu Province
ID : XCL-043
Organisme : Natural Science Foundation of Jiangsu Province
ID : BK20170045

Informations de copyright

© 2021 Wiley-VCH GmbH.

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Auteurs

Haodong Liu (H)

Frontiers Science Center for Flexible Electronics (FSCFE), Shaanxi Institute of Flexible Electronics (SIFE), Shaanxi Institute of Biomedical Materials and Engineering (SIBME), Northwestern Polytechnical University (NPU), 127 West Youyi Road, Xi'an, 710072, P. R. China.

Hongjian Zhang (H)

Frontiers Science Center for Flexible Electronics (FSCFE), Shaanxi Institute of Flexible Electronics (SIFE), Shaanxi Institute of Biomedical Materials and Engineering (SIBME), Northwestern Polytechnical University (NPU), 127 West Youyi Road, Xi'an, 710072, P. R. China.

Wenqi Han (W)

Frontiers Science Center for Flexible Electronics (FSCFE), Shaanxi Institute of Flexible Electronics (SIFE), Shaanxi Institute of Biomedical Materials and Engineering (SIBME), Northwestern Polytechnical University (NPU), 127 West Youyi Road, Xi'an, 710072, P. R. China.

Huijuan Lin (H)

Institute of Advanced Materials (IAM), Key Laboratory of Institute of Advanced Materials, Nanjing Tech University, 30 South Puzhu Road, Nanjing, 211816, P. R. China.

Ruizi Li (R)

Frontiers Science Center for Flexible Electronics (FSCFE), Shaanxi Institute of Flexible Electronics (SIFE), Shaanxi Institute of Biomedical Materials and Engineering (SIBME), Northwestern Polytechnical University (NPU), 127 West Youyi Road, Xi'an, 710072, P. R. China.

Jixin Zhu (J)

Frontiers Science Center for Flexible Electronics (FSCFE), Shaanxi Institute of Flexible Electronics (SIFE), Shaanxi Institute of Biomedical Materials and Engineering (SIBME), Northwestern Polytechnical University (NPU), 127 West Youyi Road, Xi'an, 710072, P. R. China.
Institute of Advanced Materials (IAM), Key Laboratory of Institute of Advanced Materials, Nanjing Tech University, 30 South Puzhu Road, Nanjing, 211816, P. R. China.

Wei Huang (W)

Frontiers Science Center for Flexible Electronics (FSCFE), Shaanxi Institute of Flexible Electronics (SIFE), Shaanxi Institute of Biomedical Materials and Engineering (SIBME), Northwestern Polytechnical University (NPU), 127 West Youyi Road, Xi'an, 710072, P. R. China.
Institute of Advanced Materials (IAM), Key Laboratory of Institute of Advanced Materials, Nanjing Tech University, 30 South Puzhu Road, Nanjing, 211816, P. R. China.

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