Stress-Assisted Thermal Diffusion Barrier Breakdown in Ion Beam Deposited Cu/W Nano-Multilayers on Si Substrate Observed by
GISAXS
copper/tungsten
nano-multilayer
residual stress
thermal diffusion
Journal
ACS applied materials & interfaces
ISSN: 1944-8252
Titre abrégé: ACS Appl Mater Interfaces
Pays: United States
ID NLM: 101504991
Informations de publication
Date de publication:
10 Feb 2021
10 Feb 2021
Historique:
pubmed:
29
1
2021
medline:
29
1
2021
entrez:
28
1
2021
Statut:
ppublish
Résumé
The thermal stability of Cu/W nano-multilayers deposited on a Si substrate using ion beam deposition was analyzed
Identifiants
pubmed: 33507755
doi: 10.1021/acsami.0c19173
pmc: PMC8023532
doi:
Types de publication
Journal Article
Langues
eng
Sous-ensembles de citation
IM
Pagination
6795-6804Références
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