Melting of PCMs Embedded in Copper Foams: An Experimental Study.

A smart possible way to cool electronics equipment is represented by passive methods, which do not require an additional power input, such as Phase Change Materials (PCMs). PCMs have the benefit of their latent heat being exploited during the phase change from solid to liquid state. This paper experimentally investigates the melting of different PCMs having different melting temperatures (42, 55 and 64 °C). Two copper foams, having 10 PPI and relative densities of 6.7% and 9.5%, i.e., porosities of 93.3% and 90.5%, respectively, are used to enhance the thermal conductivity of PCMs. The block composed by the PCM and the copper foam is heated from one side, applying three different heat fluxes (10, 15 and 20 kW m