In-situ study of electrochemical migration of tin in the presence of bromide ion.
Journal
Scientific reports
ISSN: 2045-2322
Titre abrégé: Sci Rep
Pays: England
ID NLM: 101563288
Informations de publication
Date de publication:
03 Aug 2021
03 Aug 2021
Historique:
received:
21
11
2020
accepted:
19
07
2021
entrez:
4
8
2021
pubmed:
5
8
2021
medline:
5
8
2021
Statut:
epublish
Résumé
The miniaturization of electronic devices and the consequent decrease in the distance between conductive lines have increased the risk of short circuit failure due to electrochemical migration (ECM). The presence of ionic contaminants affects the ECM process. This work systematically investigates the ECM of tin (Sn) in the presence of bromide ions (Br
Identifiants
pubmed: 34344974
doi: 10.1038/s41598-021-95276-0
pii: 10.1038/s41598-021-95276-0
pmc: PMC8333333
doi:
Types de publication
Journal Article
Langues
eng
Sous-ensembles de citation
IM
Pagination
15768Informations de copyright
© 2021. The Author(s).
Références
Environ Int. 2020 Nov;144:106041
pubmed: 32822924