Use of Hyperspectral Imaging for the Quantification of Organic Contaminants on Copper Surfaces for Electronic Applications.

AES HSI RF SVM XPS cleaning after soldering cleanliness elastic net machine learning multivariate analysis organic residues spectral imaging

Journal

Sensors (Basel, Switzerland)
ISSN: 1424-8220
Titre abrégé: Sensors (Basel)
Pays: Switzerland
ID NLM: 101204366

Informations de publication

Date de publication:
19 Aug 2021
Historique:
received: 27 07 2021
revised: 17 08 2021
accepted: 18 08 2021
entrez: 28 8 2021
pubmed: 29 8 2021
medline: 1 9 2021
Statut: epublish

Résumé

To correctly assess the cleanliness of technical surfaces in a production process, corresponding online monitoring systems must provide sufficient data. A promising method for fast, large-area, and non-contact monitoring is hyperspectral imaging (HSI), which was used in this paper for the detection and quantification of organic surface contaminations. Depending on the cleaning parameter constellation, different levels of organic residues remained on the surface. Afterwards, the cleanliness was determined by the carbon content in the atom percent on the sample surfaces, characterized by XPS and AES. The HSI data and the XPS measurements were correlated, using machine learning methods, to generate a predictive model for the carbon content of the surface. The regression algorithms elastic net, random forest regression, and support vector machine regression were used. Overall, the developed method was able to quantify organic contaminations on technical surfaces. The best regression model found was a random forest model, which achieved an R

Identifiants

pubmed: 34451034
pii: s21165595
doi: 10.3390/s21165595
pmc: PMC8402274
pii:
doi:

Substances chimiques

Copper 789U1901C5

Types de publication

Journal Article

Langues

eng

Sous-ensembles de citation

IM

Références

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pubmed: 9866169
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pubmed: 30551646

Auteurs

Tim Englert (T)

Robert Bosch GmbH, Automotive Electronics, Postfach 1342, 72703 Reutlingen, Germany.
Institute of Electrochemistry, Ulm University, Albert-Einstein-Allee 47, 89081 Ulm, Germany.

Florian Gruber (F)

Fraunhofer Institute for Material and Beam Technology IWS, Winterbergstraße 28, 01277 Dresden, Germany.

Jan Stiedl (J)

Robert Bosch GmbH, Automotive Electronics, Postfach 1342, 72703 Reutlingen, Germany.

Simon Green (S)

Robert Bosch GmbH, Automotive Electronics, Postfach 1342, 72703 Reutlingen, Germany.

Timo Jacob (T)

Institute of Electrochemistry, Ulm University, Albert-Einstein-Allee 47, 89081 Ulm, Germany.

Karsten Rebner (K)

Process Analysis and Technology PA & T, Reutlingen University, Alteburgstraße 150, 72762 Reutlingen, Germany.

Wulf Grählert (W)

Fraunhofer Institute for Material and Beam Technology IWS, Winterbergstraße 28, 01277 Dresden, Germany.

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Classifications MeSH