Understanding Grain Boundary Electrical Resistivity in Cu: The Effect of Boundary Structure.
copper
electrical resistivity
excess volume
grain boundaries
grain boundary structure
Journal
ACS nano
ISSN: 1936-086X
Titre abrégé: ACS Nano
Pays: United States
ID NLM: 101313589
Informations de publication
Date de publication:
26 Oct 2021
26 Oct 2021
Historique:
pubmed:
5
10
2021
medline:
5
10
2021
entrez:
4
10
2021
Statut:
ppublish
Résumé
Grain boundaries (GBs) in metals usually increase electrical resistivity due to their distinct atomic arrangement compared to the grain interior. While the GB structure has a crucial influence on the electrical properties, its relationship with resistivity is poorly understood. Here, we perform a systematic study on the resistivity-structure relationship in Cu tilt GBs, employing high-resolution
Identifiants
pubmed: 34605639
doi: 10.1021/acsnano.1c06367
pmc: PMC8552493
doi:
Types de publication
Journal Article
Langues
eng
Sous-ensembles de citation
IM
Pagination
16607-16615Références
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