Miniaturization of mechanical actuators in skin-integrated electronics for haptic interfaces.

Electrical and electronic engineering Electronic properties and materials

Journal

Microsystems & nanoengineering
ISSN: 2055-7434
Titre abrégé: Microsyst Nanoeng
Pays: England
ID NLM: 101695458

Informations de publication

Date de publication:
2021
Historique:
received: 10 01 2021
revised: 29 05 2021
accepted: 13 07 2021
entrez: 8 11 2021
pubmed: 9 11 2021
medline: 9 11 2021
Statut: epublish

Résumé

Skin-integrated electronics, also known as electronic skin (e-skin), are rapidly developing and are gradually being adopted in biomedical fields as well as in our daily lives. E-skin capable of providing sensitive and high-resolution tactile sensations and haptic feedback to the human body would open a new e-skin paradigm for closed-loop human-machine interfaces. Here, we report a class of materials and mechanical designs for the miniaturization of mechanical actuators and strategies for their integration into thin, soft e-skin for haptic interfaces. The mechanical actuators exhibit small dimensions of 5 mm diameter and 1.45 mm thickness and work in an electromagnetically driven vibrotactile mode with resonance frequency overlapping the most sensitive frequency of human skin. Nine mini actuators can be integrated simultaneously in a small area of 2 cm × 2 cm to form a 3 × 3 haptic feedback array, which is small and compact enough to mount on a thumb tip. Furthermore, the thin, soft haptic interface exhibits good mechanical properties that work properly during stretching, bending, and twisting and therefore can conformally fit onto various parts of the human body to afford programmable tactile enhancement and Braille recognition with an accuracy rate over 85%.

Identifiants

pubmed: 34745644
doi: 10.1038/s41378-021-00301-x
pii: 301
pmc: PMC8536704
doi:

Types de publication

Journal Article

Langues

eng

Pagination

85

Informations de copyright

© The Author(s) 2021.

Déclaration de conflit d'intérêts

Competing interestsThe authors declare no competing interests.

Références

Microsyst Nanoeng. 2020 Mar 9;6:16
pubmed: 34567631
Chem Rev. 2019 Apr 24;119(8):5461-5533
pubmed: 30689360
Nature. 2018 Mar 1;555(7694):83-88
pubmed: 29466334
Nature. 2019 Nov;575(7783):473-479
pubmed: 31748722
Sci Adv. 2015 Oct 30;1(9):e1500661
pubmed: 26601303
Microsyst Nanoeng. 2020 Aug 10;6:59
pubmed: 34567670
J Neurophysiol. 2006 Mar;95(3):1442-50
pubmed: 16319219
Sci Adv. 2019 Oct 11;5(10):eaax4961
pubmed: 31646177
Nat Commun. 2020 Mar 13;11(1):1369
pubmed: 32170075
Science. 2015 Oct 16;350(6258):313-6
pubmed: 26472906
Acc Chem Res. 2018 May 15;51(5):1033-1045
pubmed: 29693379
Nat Biomed Eng. 2021 Jul;5(7):759-771
pubmed: 34045731
Exp Brain Res. 2015 Oct;233(10):2777-88
pubmed: 26080756
Nature. 2014 Dec 11;516(7530):222-6
pubmed: 25503234
Research (Wash D C). 2020 Oct 17;2020:1085417
pubmed: 33134931
Nat Commun. 2013;4:1859
pubmed: 23673644
Microsyst Nanoeng. 2019 Jan 28;5:3
pubmed: 31057930
Nat Mater. 2016 Sep;15(9):937-50
pubmed: 27376685
Adv Mater. 2019 Nov;31(48):e1904765
pubmed: 31538370
Sci Adv. 2017 May 31;3(5):e1700015
pubmed: 28580425
Science. 2011 Aug 12;333(6044):838-43
pubmed: 21836009
Nat Commun. 2018 Jan 16;9(1):244
pubmed: 29339793
Sci Adv. 2019 Aug 02;5(8):eaav9653
pubmed: 31414044
Acta Physiol Scand. 1954 Jul 18;31(2-3):284-9
pubmed: 13197098

Auteurs

Dengfeng Li (D)

Department of Biomedical Engineering, City University of Hong Kong, Hong Kong SAR, China.
Hong Kong Centre for Cerebro-Cardiovascular Health Engineering (COCHE), Hong Kong SAR, China.

Jiahui He (J)

Department of Biomedical Engineering, City University of Hong Kong, Hong Kong SAR, China.

Zhen Song (Z)

State Key Laboratory of Structural Analysis for Industrial Equipment, Department of Engineering Mechanics, Dalian University of Technology, Dalian, China.

Kuanming Yao (K)

Department of Biomedical Engineering, City University of Hong Kong, Hong Kong SAR, China.

Mengge Wu (M)

Department of Biomedical Engineering, City University of Hong Kong, Hong Kong SAR, China.

Haoran Fu (H)

Institute of Flexible Electronic Technology of Tsinghua, Jiaxing, China.

Yiming Liu (Y)

Department of Biomedical Engineering, City University of Hong Kong, Hong Kong SAR, China.

Zhan Gao (Z)

Department of Biomedical Engineering, City University of Hong Kong, Hong Kong SAR, China.

Jingkun Zhou (J)

Department of Biomedical Engineering, City University of Hong Kong, Hong Kong SAR, China.
Hong Kong Centre for Cerebro-Cardiovascular Health Engineering (COCHE), Hong Kong SAR, China.

Lei Wei (L)

Tencent Robotics X, Shenzhen, China.

Zhengyou Zhang (Z)

Tencent Robotics X, Shenzhen, China.

Yuan Dai (Y)

Tencent Robotics X, Shenzhen, China.

Zhaoqian Xie (Z)

State Key Laboratory of Structural Analysis for Industrial Equipment, Department of Engineering Mechanics, Dalian University of Technology, Dalian, China.
Ningbo Institute of Dalian University of Technology, Ningbo, China.

Xinge Yu (X)

Department of Biomedical Engineering, City University of Hong Kong, Hong Kong SAR, China.
Hong Kong Centre for Cerebro-Cardiovascular Health Engineering (COCHE), Hong Kong SAR, China.

Classifications MeSH