Mechanisms of Ohmic Contact Formation of Ti/Al-Based Metal Stacks on p-Doped 4H-SiC.

4H-SiC SIMS Ti3SiC2 ohmic contact simulation

Journal

Materials (Basel, Switzerland)
ISSN: 1996-1944
Titre abrégé: Materials (Basel)
Pays: Switzerland
ID NLM: 101555929

Informations de publication

Date de publication:
22 Dec 2021
Historique:
received: 22 10 2021
revised: 15 12 2021
accepted: 16 12 2021
entrez: 11 1 2022
pubmed: 12 1 2022
medline: 12 1 2022
Statut: epublish

Résumé

Ohmic contacts on p-doped 4H-SiC are essential for the fabrication of a wide range of power electron devices. Despite the fact that Ti/Al based ohmic contacts are routinely used for ohmic contacts on p-doped 4H-SiC, the underlying contact formation mechanisms are still not fully understood. TLM structures were fabricated, measured and analyzed to get a better understanding of the formation mechanism. SIMS analyses at the Ti

Identifiants

pubmed: 35009196
pii: ma15010050
doi: 10.3390/ma15010050
pmc: PMC8746140
pii:
doi:

Types de publication

Journal Article

Langues

eng

Auteurs

Matthias Kocher (M)

Fraunhofer Institute for Integrated Systems and Device Technology (IISB), Schottkystrasse 10, 91058 Erlangen, Germany.

Mathias Rommel (M)

Fraunhofer Institute for Integrated Systems and Device Technology (IISB), Schottkystrasse 10, 91058 Erlangen, Germany.

Paweł Piotr Michałowski (PP)

Łukasiewicz Research Network-Institute of Microelectronics and Photonics, Aleja Lotników 32/46, 02-668 Warsaw, Poland.

Tobias Erlbacher (T)

Fraunhofer Institute for Integrated Systems and Device Technology (IISB), Schottkystrasse 10, 91058 Erlangen, Germany.
Chair of Electron Devices, Friedrich-Alexander-University Erlangen-Nuremberg, Cauerstraße 6, 91058 Erlangen, Germany.

Classifications MeSH