Evaluation of Compressive Strength and Thermal Conductivity of Sand Stabilized with Epoxy Emulsion and Polymer Solution.
acrylic polymer
compressive strength
epoxy emulsion
ground-coupled heat pump
heat transfer fluid model
sand stabilization
thermal conductivity
Journal
Polymers
ISSN: 2073-4360
Titre abrégé: Polymers (Basel)
Pays: Switzerland
ID NLM: 101545357
Informations de publication
Date de publication:
11 May 2022
11 May 2022
Historique:
received:
08
04
2022
revised:
06
05
2022
accepted:
09
05
2022
entrez:
28
5
2022
pubmed:
29
5
2022
medline:
29
5
2022
Statut:
epublish
Résumé
This paper presents findings obtained by evaluating the compressive strength, thermal conductivity, and durability of sand cylinder specimens stabilized with either epoxy emulsion (EM), acrylic polymer aqueous solution (APAS), EM-APAS mixture, or EM-APAS-lime mixture. Given the data obtained from the laboratory test, simulation analysis that uses a heat transfer fluid model of a ground-coupled heat pump (GCHP) system confirms the EM-APAS-lime binder performs best in the compressive strength and thermal conductivity; EM-APAS mixture performs best in the durability. However, the slake durability index of specimens containing EM-APAS-lime is equal to or greater than 80%. In addition, the compressive strength of sand stabilized with the EM-APAS-lime mixture is more than three times that of sand stabilized with cement. The thermal conductivity of sand stabilized with cement and that of sand treated with EM-APAS-lime mixture are 0.1 W/m·K and 0.9-1 W/m·K, respectively. It is confirmed that the heat collection of sand stabilized with EM-APAS-lime outperforms five times over that of sand stabilized with cement. These findings provide admissible evidence that the EM-APAS-lime mixture, which outperforms cement in compressive strength and thermal conductivity, is most suitable for ground improvement binder for GCHP systems.
Identifiants
pubmed: 35631846
pii: polym14101964
doi: 10.3390/polym14101964
pmc: PMC9147147
pii:
doi:
Types de publication
Journal Article
Langues
eng
Subventions
Organisme : National Research Foundation of Korea
ID : 2019R1A2C3003890
Références
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