Tactile Near-Sensor Analogue Computing for Ultrafast Responsive Artificial Skin.

flexible electronics in-memory computing memristors near-sensor computing tactile computing

Journal

Advanced materials (Deerfield Beach, Fla.)
ISSN: 1521-4095
Titre abrégé: Adv Mater
Pays: Germany
ID NLM: 9885358

Informations de publication

Date de publication:
Aug 2022
Historique:
revised: 11 06 2022
received: 01 03 2022
pubmed: 12 7 2022
medline: 27 8 2022
entrez: 11 7 2022
Statut: ppublish

Résumé

Ultrafast artificial skin enables unprecedented tactile internet applications in prosthetics, robotics, and human-machine interactions. However, current artificial skin systems that rely on front-end interface electronics typically perform redundant data transfer and analogue-to-digital conversions for decision-making, causing long latency (milliseconds). Here, a near-sensor analogue computing system based on a flexible memristor array for artificial skin applications is reported. This system, which seamlessly integrates a tactile sensor array with a flexible hafnium oxide memristor array, can simultaneously sense and compute raw multiple analogue pressure signals without interface electronics. As a proof-of-concept, the system is used for real-time noise reduction and edge detection of tactile stimuli. One sensing-computing operation of this system takes about 400 ns and consumes on average 1000 times less power than a conventional interface electronic system. The results demonstrate that near-sensor analogue computing offers an ultrafast and energy-efficient route to large-scale artificial skin systems.

Identifiants

pubmed: 35816720
doi: 10.1002/adma.202201962
doi:

Types de publication

Journal Article

Langues

eng

Sous-ensembles de citation

IM

Pagination

e2201962

Subventions

Organisme : National Key R&D Program of China
ID : 2021YFB3601200
Organisme : National Nature Science Foundation of China
ID : 62104042
Organisme : Agency for Science, Technology and Research
ID : A18A1b0045
Organisme : National Research Foundation Singapore
ID : NRF-NRFI2017-07
Organisme : Singapore Ministry of Education
ID : MOE2019-T2-2-022

Informations de copyright

© 2022 Wiley-VCH GmbH.

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Auteurs

Ming Wang (M)

Frontier Institute of Chip and System, Zhangjiang Fudan International Innovation Center, Fudan University, Shanghai, 200433, China.
Innovative Center for Flexible Devices (iFLEX), Max Planck - NTU Joint Lab for Artificial Senses, School of Materials Science and Engineering, Nanyang Technological University, 50 Nanyang Avenue, Singapore, 639798, Singapore.

Jiaqi Tu (J)

Innovative Center for Flexible Devices (iFLEX), Max Planck - NTU Joint Lab for Artificial Senses, School of Materials Science and Engineering, Nanyang Technological University, 50 Nanyang Avenue, Singapore, 639798, Singapore.
Institute of Flexible Electronics Technology of THU, Zhejiang, Jiaxing, 314000, China.

Zhangcheng Huang (Z)

Frontier Institute of Chip and System, Zhangjiang Fudan International Innovation Center, Fudan University, Shanghai, 200433, China.

Ting Wang (T)

Innovative Center for Flexible Devices (iFLEX), Max Planck - NTU Joint Lab for Artificial Senses, School of Materials Science and Engineering, Nanyang Technological University, 50 Nanyang Avenue, Singapore, 639798, Singapore.

Zhihua Liu (Z)

Innovative Center for Flexible Devices (iFLEX), Max Planck - NTU Joint Lab for Artificial Senses, School of Materials Science and Engineering, Nanyang Technological University, 50 Nanyang Avenue, Singapore, 639798, Singapore.

Feilong Zhang (F)

Innovative Center for Flexible Devices (iFLEX), Max Planck - NTU Joint Lab for Artificial Senses, School of Materials Science and Engineering, Nanyang Technological University, 50 Nanyang Avenue, Singapore, 639798, Singapore.

Wenlong Li (W)

Innovative Center for Flexible Devices (iFLEX), Max Planck - NTU Joint Lab for Artificial Senses, School of Materials Science and Engineering, Nanyang Technological University, 50 Nanyang Avenue, Singapore, 639798, Singapore.

Ke He (K)

Innovative Center for Flexible Devices (iFLEX), Max Planck - NTU Joint Lab for Artificial Senses, School of Materials Science and Engineering, Nanyang Technological University, 50 Nanyang Avenue, Singapore, 639798, Singapore.

Liang Pan (L)

Innovative Center for Flexible Devices (iFLEX), Max Planck - NTU Joint Lab for Artificial Senses, School of Materials Science and Engineering, Nanyang Technological University, 50 Nanyang Avenue, Singapore, 639798, Singapore.

Xumeng Zhang (X)

Frontier Institute of Chip and System, Zhangjiang Fudan International Innovation Center, Fudan University, Shanghai, 200433, China.

Xue Feng (X)

Institute of Flexible Electronics Technology of THU, Zhejiang, Jiaxing, 314000, China.

Qi Liu (Q)

Frontier Institute of Chip and System, Zhangjiang Fudan International Innovation Center, Fudan University, Shanghai, 200433, China.

Ming Liu (M)

Frontier Institute of Chip and System, Zhangjiang Fudan International Innovation Center, Fudan University, Shanghai, 200433, China.

Xiaodong Chen (X)

Innovative Center for Flexible Devices (iFLEX), Max Planck - NTU Joint Lab for Artificial Senses, School of Materials Science and Engineering, Nanyang Technological University, 50 Nanyang Avenue, Singapore, 639798, Singapore.

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