Electron-phonon relaxation at the Au/WSe


Journal

Nanoscale
ISSN: 2040-3372
Titre abrégé: Nanoscale
Pays: England
ID NLM: 101525249

Informations de publication

Date de publication:
28 Jul 2022
Historique:
pubmed: 15 7 2022
medline: 15 7 2022
entrez: 14 7 2022
Statut: epublish

Résumé

Thermal transport at nanoscale metal-semiconductor interfaces

Identifiants

pubmed: 35833340
doi: 10.1039/d2nr00728b
doi:

Types de publication

Journal Article

Langues

eng

Sous-ensembles de citation

IM

Pagination

10514-10523

Auteurs

Teng-Fei Lu (TF)

School of Materials Science and Engineering, Dalian Jiaotong University, Dalian 116028, Liaoning Province, China.

Shriya Gumber (S)

Department of Chemistry, University of Southern California, Los Angeles, CA 90089, USA. prezhdo@usc.edu.

Marina V Tokina (MV)

Department of Chemistry, University of Southern California, Los Angeles, CA 90089, USA. prezhdo@usc.edu.

John A Tomko (JA)

Department of Mechanical and Aerospace Engineering, University of Virginia, Charlottesville, VA 22904, USA.

Patrick E Hopkins (PE)

Department of Mechanical and Aerospace Engineering, University of Virginia, Charlottesville, VA 22904, USA.
Department of Materials Science and Engineering, University of Virginia, Charlottesville, VA 22904, USA.
Department of Physics, University of Virginia, Charlottesville, VA 22904, USA.

Oleg V Prezhdo (OV)

Department of Chemistry, University of Southern California, Los Angeles, CA 90089, USA. prezhdo@usc.edu.
Department of Physics and Astronomy, University of Southern California, Los Angeles, CA 90089, USA.

Classifications MeSH