Augmented tactile-perception and haptic-feedback rings as human-machine interfaces aiming for immersive interactions.


Journal

Nature communications
ISSN: 2041-1723
Titre abrégé: Nat Commun
Pays: England
ID NLM: 101528555

Informations de publication

Date de publication:
05 09 2022
Historique:
received: 05 03 2022
accepted: 12 08 2022
entrez: 6 9 2022
pubmed: 7 9 2022
medline: 9 9 2022
Statut: epublish

Résumé

Advancements of virtual reality technology pave the way for developing wearable devices to enable somatosensory sensation, which can bring more comprehensive perception and feedback in the metaverse-based virtual society. Here, we propose augmented tactile-perception and haptic-feedback rings with multimodal sensing and feedback capabilities. This highly integrated ring consists of triboelectric and pyroelectric sensors for tactile and temperature perception, and vibrators and nichrome heaters for vibro- and thermo-haptic feedback. All these components integrated on the ring can be directly driven by a custom wireless platform of low power consumption for wearable/portable scenarios. With voltage integration processing, high-resolution continuous finger motion tracking is achieved via the triboelectric tactile sensor, which also contributes to superior performance in gesture/object recognition with artificial intelligence analysis. By fusing the multimodal sensing and feedback functions, an interactive metaverse platform with cross-space perception capability is successfully achieved, giving people a face-to-face like immersive virtual social experience.

Identifiants

pubmed: 36064838
doi: 10.1038/s41467-022-32745-8
pii: 10.1038/s41467-022-32745-8
pmc: PMC9445040
doi:

Types de publication

Journal Article Research Support, Non-U.S. Gov't

Langues

eng

Sous-ensembles de citation

IM

Pagination

5224

Informations de copyright

© 2022. The Author(s).

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Auteurs

Zhongda Sun (Z)

Department of Electrical & Computer Engineering, National University of Singapore, 4 Engineering Drive 3, Singapore, 117583, Singapore.
Center for Intelligent Sensors and MEMS, National University of Singapore, 4 Engineering Drive 3, Singapore, 117583, Singapore.
Singapore Institute of Manufacturing Technology and National University of Singapore (SIMTech-NUS) Joint Lab on Large-area Flexible Hybrid Electronics, National University of Singapore, 4 Engineering Drive 3, Singapore, 117583, Singapore.
National University of Singapore Suzhou Research Institute (NUSRI), Suzhou Industrial Park, Suzhou, 215123, China.

Minglu Zhu (M)

Department of Electrical & Computer Engineering, National University of Singapore, 4 Engineering Drive 3, Singapore, 117583, Singapore.
Center for Intelligent Sensors and MEMS, National University of Singapore, 4 Engineering Drive 3, Singapore, 117583, Singapore.
National University of Singapore Suzhou Research Institute (NUSRI), Suzhou Industrial Park, Suzhou, 215123, China.

Xuechuan Shan (X)

Singapore Institute of Manufacturing Technology and National University of Singapore (SIMTech-NUS) Joint Lab on Large-area Flexible Hybrid Electronics, National University of Singapore, 4 Engineering Drive 3, Singapore, 117583, Singapore.
Printed Intelligent Device Group, Singapore Institute of Manufacturing Technology, Agency for Science, Technology and Research (A*STAR), Singapore, 637662, Singapore.

Chengkuo Lee (C)

Department of Electrical & Computer Engineering, National University of Singapore, 4 Engineering Drive 3, Singapore, 117583, Singapore. elelc@nus.edu.sg.
Center for Intelligent Sensors and MEMS, National University of Singapore, 4 Engineering Drive 3, Singapore, 117583, Singapore. elelc@nus.edu.sg.
Singapore Institute of Manufacturing Technology and National University of Singapore (SIMTech-NUS) Joint Lab on Large-area Flexible Hybrid Electronics, National University of Singapore, 4 Engineering Drive 3, Singapore, 117583, Singapore. elelc@nus.edu.sg.
National University of Singapore Suzhou Research Institute (NUSRI), Suzhou Industrial Park, Suzhou, 215123, China. elelc@nus.edu.sg.
NUS Graduate School-Integrative Sciences and Engineering Program (ISEP), National University of Singapore, Singapore, 119077, Singapore. elelc@nus.edu.sg.

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Classifications MeSH