Low Temperature Transient Liquid Phase Bonding of Alumina Ceramics with the Bi
bonding
interlayer
joining
joining of ceramics
low-temperature joining
transient-liquid-phase bonding
Journal
Materials (Basel, Switzerland)
ISSN: 1996-1944
Titre abrégé: Materials (Basel)
Pays: Switzerland
ID NLM: 101555929
Informations de publication
Date de publication:
06 Oct 2022
06 Oct 2022
Historique:
received:
02
08
2022
revised:
23
09
2022
accepted:
29
09
2022
entrez:
14
10
2022
pubmed:
15
10
2022
medline:
15
10
2022
Statut:
epublish
Résumé
Alumina ceramics were joined by a transient liquid phase (TLP) bonding method at relatively lower temperatures, using mixed powders of Bi
Identifiants
pubmed: 36234279
pii: ma15196940
doi: 10.3390/ma15196940
pmc: PMC9571489
pii:
doi:
Types de publication
Journal Article
Langues
eng
Subventions
Organisme : Innosuisse - Swiss Innovation Agency
ID : 42449.1 IP-ENG
Déclaration de conflit d'intérêts
The authors declare no conflict of interest.
Références
Appl Radiat Isot. 2015 Apr;98:1-6
pubmed: 25617710
Biomaterials. 1999 Jan;20(1):1-25
pubmed: 9916767