Integrated 64 pixel UV image sensor and readout in a silicon carbide CMOS technology.

Electrical and electronic engineering Optical sensors

Journal

Microsystems & nanoengineering
ISSN: 2055-7434
Titre abrégé: Microsyst Nanoeng
Pays: England
ID NLM: 101695458

Informations de publication

Date de publication:
2022
Historique:
received: 10 11 2021
revised: 31 05 2022
accepted: 24 07 2022
entrez: 28 10 2022
pubmed: 29 10 2022
medline: 29 10 2022
Statut: epublish

Résumé

This work demonstrates the first on-chip UV optoelectronic integration in 4H-SiC CMOS, which includes an image sensor with 64 active pixels and a total of 1263 transistors on a 100 mm

Identifiants

pubmed: 36304906
doi: 10.1038/s41378-022-00446-3
pii: 446
pmc: PMC9592596
doi:

Types de publication

Journal Article

Langues

eng

Pagination

114

Informations de copyright

© The Author(s) 2022.

Déclaration de conflit d'intérêts

Competing interestsThe authors declare no competing interests.

Références

Sensors (Basel). 2019 Dec 18;20(1):
pubmed: 31861428
Opt Lett. 2006 Jun 1;31(11):1591-3
pubmed: 16688230
Sensors (Basel). 2022 Jan 18;22(3):
pubmed: 35161472
Opt Express. 2010 May 24;18(11):11713-9
pubmed: 20589031
Microsyst Nanoeng. 2016 Oct 10;2:16048
pubmed: 31057836

Auteurs

Joost Romijn (J)

Laboratory of Electronic Components, Technology and Materials (ECTM), Department of Microelectronics, Delft University of Technology, Delft, The Netherlands.

Sten Vollebregt (S)

Laboratory of Electronic Components, Technology and Materials (ECTM), Department of Microelectronics, Delft University of Technology, Delft, The Netherlands.

Luke M Middelburg (LM)

Laboratory of Electronic Components, Technology and Materials (ECTM), Department of Microelectronics, Delft University of Technology, Delft, The Netherlands.

Brahim El Mansouri (BE)

Laboratory of Electronic Components, Technology and Materials (ECTM), Department of Microelectronics, Delft University of Technology, Delft, The Netherlands.

Henk W van Zeijl (HW)

Laboratory of Electronic Components, Technology and Materials (ECTM), Department of Microelectronics, Delft University of Technology, Delft, The Netherlands.

Alexander May (A)

Fraunhofer Institute for Integrated Systems and Devices Technology IISB, Erlangen, Germany.

Tobias Erlbacher (T)

Fraunhofer Institute for Integrated Systems and Devices Technology IISB, Erlangen, Germany.

Johan Leijtens (J)

Lens R&D, Noordwijk, The Netherlands.

Guoqi Zhang (G)

Laboratory of Electronic Components, Technology and Materials (ECTM), Department of Microelectronics, Delft University of Technology, Delft, The Netherlands.

Pasqualina M Sarro (PM)

Laboratory of Electronic Components, Technology and Materials (ECTM), Department of Microelectronics, Delft University of Technology, Delft, The Netherlands.

Classifications MeSH