Direct Writing of Silver Nanowire Patterns with Line Width down to 50 μm and Ultrahigh Conductivity.

direct ink writing electroadhesion flexible electrodes printing electronics silver nanowires

Journal

ACS applied materials & interfaces
ISSN: 1944-8252
Titre abrégé: ACS Appl Mater Interfaces
Pays: United States
ID NLM: 101504991

Informations de publication

Date de publication:
10 Feb 2023
Historique:
entrez: 10 2 2023
pubmed: 11 2 2023
medline: 11 2 2023
Statut: aheadofprint

Résumé

Direct writing of one-dimensional nanomaterials with large aspect ratios into customized, highly conductive, and high-resolution patterns is a challenging task. In this work, thin silver nanowires (AgNWs) with a length-to-diameter ratio of 730 are employed as a representative example to demonstrate a potent direct ink writing (DIW) strategy, in which aqueous inks using a natural polymer, sodium alginate, as the thickening agent can be easily patterned with arbitrary geometries and controllable structural features on a variety of planar substrates. With the aid of a quick spray-and-dry postprinting treatment at room temperature, the electrical conductivity and substrate adhesion of the written AgNWs-patterns improve simultaneously. This simple, environment benign, and low-temperature DIW strategy is effective for depositing AgNWs into patterns that are high-resolution (with line width down to 50 μm), highly conductive (up to 1.26 × 10

Identifiants

pubmed: 36762969
doi: 10.1021/acsami.2c22885
doi:

Types de publication

Journal Article

Langues

eng

Sous-ensembles de citation

IM

Auteurs

Xiangyi Kong (X)

School of Chemistry and Biological Engineering, University of Science and Technology Beijing, Beijing 100083, China.

Hejian Li (H)

School of Chemistry and Biological Engineering, University of Science and Technology Beijing, Beijing 100083, China.

Jianping Wang (J)

School of Chemistry and Biological Engineering, University of Science and Technology Beijing, Beijing 100083, China.

Yangyang Wang (Y)

School of Chemistry and Biological Engineering, University of Science and Technology Beijing, Beijing 100083, China.

Liang Zhang (L)

School of Chemistry and Biological Engineering, University of Science and Technology Beijing, Beijing 100083, China.

Min Gong (M)

School of Chemistry and Biological Engineering, University of Science and Technology Beijing, Beijing 100083, China.

Xiang Lin (X)

School of Chemistry and Biological Engineering, University of Science and Technology Beijing, Beijing 100083, China.

Dongrui Wang (D)

School of Chemistry and Biological Engineering, University of Science and Technology Beijing, Beijing 100083, China.

Classifications MeSH