Jellybean Quantum Dots in Silicon for Qubit Coupling and On-Chip Quantum Chemistry.

quantum computation quantum devices quantum dots silicon nanostructures spin qubits

Journal

Advanced materials (Deerfield Beach, Fla.)
ISSN: 1521-4095
Titre abrégé: Adv Mater
Pays: Germany
ID NLM: 9885358

Informations de publication

Date de publication:
May 2023
Historique:
revised: 13 01 2023
received: 18 09 2022
medline: 23 2 2023
pubmed: 23 2 2023
entrez: 22 2 2023
Statut: ppublish

Résumé

The small size and excellent integrability of silicon metal-oxide-semiconductor (SiMOS) quantum dot spin qubits make them an attractive system for mass-manufacturable, scaled-up quantum processors. Furthermore, classical control electronics can be integrated on-chip, in-between the qubits, if an architecture with sparse arrays of qubits is chosen. In such an architecture qubits are either transported across the chip via shuttling or coupled via mediating quantum systems over short-to-intermediate distances. This paper investigates the charge and spin characteristics of an elongated quantum dot-a so-called jellybean quantum dot-for the prospects of acting as a qubit-qubit coupler. Charge transport, charge sensing, and magneto-spectroscopy measurements are performed on a SiMOS quantum dot device at mK temperature and compared to Hartree-Fock multi-electron simulations. At low electron occupancies where disorder effects and strong electron-electron interaction dominate over the electrostatic confinement potential, the data reveals the formation of three coupled dots, akin to a tunable, artificial molecule. One dot is formed centrally under the gate and two are formed at the edges. At high electron occupancies, these dots merge into one large dot with well-defined spin states, verifying that jellybean dots have the potential to be used as qubit couplers in future quantum computing architectures.

Identifiants

pubmed: 36805699
doi: 10.1002/adma.202208557
doi:

Types de publication

Journal Article

Langues

eng

Sous-ensembles de citation

IM

Pagination

e2208557

Subventions

Organisme : Australian Research Council
ID : CE170100012
Organisme : Australian Research Council
ID : FL190100167
Organisme : Australian Research Council
ID : LE160100069
Organisme : Army Research Office
ID : W911NF-17-1-0198

Informations de copyright

© 2023 The Authors. Advanced Materials published by Wiley-VCH GmbH.

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Auteurs

Zeheng Wang (Z)

School of Electrical Engineering and Telecommunications, The University of New South Wales, Sydney, NSW, 2052, Australia.

MengKe Feng (M)

School of Electrical Engineering and Telecommunications, The University of New South Wales, Sydney, NSW, 2052, Australia.

Santiago Serrano (S)

School of Electrical Engineering and Telecommunications, The University of New South Wales, Sydney, NSW, 2052, Australia.

William Gilbert (W)

School of Electrical Engineering and Telecommunications, The University of New South Wales, Sydney, NSW, 2052, Australia.
Diraq, Sydney, NSW, 2052, Australia.

Ross C C Leon (RCC)

School of Electrical Engineering and Telecommunications, The University of New South Wales, Sydney, NSW, 2052, Australia.

Tuomo Tanttu (T)

School of Electrical Engineering and Telecommunications, The University of New South Wales, Sydney, NSW, 2052, Australia.
Diraq, Sydney, NSW, 2052, Australia.

Philip Mai (P)

School of Electrical Engineering and Telecommunications, The University of New South Wales, Sydney, NSW, 2052, Australia.

Dylan Liang (D)

School of Electrical Engineering and Telecommunications, The University of New South Wales, Sydney, NSW, 2052, Australia.

Jonathan Y Huang (JY)

School of Electrical Engineering and Telecommunications, The University of New South Wales, Sydney, NSW, 2052, Australia.

Yue Su (Y)

School of Electrical Engineering and Telecommunications, The University of New South Wales, Sydney, NSW, 2052, Australia.

Wee Han Lim (WH)

School of Electrical Engineering and Telecommunications, The University of New South Wales, Sydney, NSW, 2052, Australia.
Diraq, Sydney, NSW, 2052, Australia.

Fay E Hudson (FE)

School of Electrical Engineering and Telecommunications, The University of New South Wales, Sydney, NSW, 2052, Australia.
Diraq, Sydney, NSW, 2052, Australia.

Christopher C Escott (CC)

School of Electrical Engineering and Telecommunications, The University of New South Wales, Sydney, NSW, 2052, Australia.
Diraq, Sydney, NSW, 2052, Australia.

Andrea Morello (A)

School of Electrical Engineering and Telecommunications, The University of New South Wales, Sydney, NSW, 2052, Australia.

Chih Hwan Yang (CH)

School of Electrical Engineering and Telecommunications, The University of New South Wales, Sydney, NSW, 2052, Australia.
Diraq, Sydney, NSW, 2052, Australia.

Andrew S Dzurak (AS)

School of Electrical Engineering and Telecommunications, The University of New South Wales, Sydney, NSW, 2052, Australia.
Diraq, Sydney, NSW, 2052, Australia.

Andre Saraiva (A)

School of Electrical Engineering and Telecommunications, The University of New South Wales, Sydney, NSW, 2052, Australia.
Diraq, Sydney, NSW, 2052, Australia.

Arne Laucht (A)

School of Electrical Engineering and Telecommunications, The University of New South Wales, Sydney, NSW, 2052, Australia.
Diraq, Sydney, NSW, 2052, Australia.

Classifications MeSH