Regulated Thermal Boundary Conductance between Copper and Diamond through Nanoscale Interfacial Rough Structures.
interfacial roughness
molecular dynamics simulation
phonon transmission efficiency
thermal boundary conductance
time-domain thermoreflectance
Journal
ACS applied materials & interfaces
ISSN: 1944-8252
Titre abrégé: ACS Appl Mater Interfaces
Pays: United States
ID NLM: 101504991
Informations de publication
Date de publication:
29 Mar 2023
29 Mar 2023
Historique:
medline:
17
3
2023
pubmed:
17
3
2023
entrez:
16
3
2023
Statut:
ppublish
Résumé
Interfacial structure optimization is important to enhance the thermal boundary conductance (TBC) as well as the overall performance of thermal conductive composites. In this work, the effect of interfacial roughness on the TBC between copper and diamond is investigated with molecular dynamics (MD) simulations and time-domain thermoreflectance (TDTR) experiments. It is found from MD simulations that the thermal transport efficiency across a rough interface is higher, and the TBC can be improved 5.5 times to 133 MW/m
Identifiants
pubmed: 36924078
doi: 10.1021/acsami.2c21514
doi:
Types de publication
Journal Article
Langues
eng
Sous-ensembles de citation
IM