Direct Numerical Simulation of Surface Wrinkling for Extraction of Thin Metal Film Material Properties.
FEM
direct simulation
materials properties
surface wrinkling
Journal
Micromachines
ISSN: 2072-666X
Titre abrégé: Micromachines (Basel)
Pays: Switzerland
ID NLM: 101640903
Informations de publication
Date de publication:
28 Mar 2023
28 Mar 2023
Historique:
received:
27
01
2023
revised:
20
03
2023
accepted:
27
03
2023
medline:
8
7
2023
pubmed:
8
7
2023
entrez:
8
7
2023
Statut:
epublish
Résumé
This paper presents a direct numerical simulation for the extraction of material properties based on thin-film wrinkling on scotch tape. Conventional FEM-based buckling simulation sometimes requires complex modeling techniques concerning mesh element manipulation or boundary conditions. The direct numerical simulation differs from FEM (finite element method)-based conventional two-step linear-nonlinear buckling simulation in that mechanical imperfections are directly applied into the elements of the simulation model. Hence, it can be performed in one step to find the wrinkling wavelength and amplitude, which are key parameters to extract the material mechanical properties. Moreover, the direct simulation can reduce simulation time and modeling complexity. Using the direct model, the effect of the number of imperfections on wrinkling characteristics was first studied, and then wrinkling wavelengths depending on the elastic moduli of the associated materials were prepared for the extraction of material properties. Thin-film wrinkling test patterns on scotch tape were fabricated using the transfer technique with low adhesion between metal films and the polyimide substrate. The material properties of the thin metal films were determined by comparing the measured wrinkling wavelengths and the proposed direct simulation results. By consequence, the elastic moduli of 300 nm thick gold film and 300 nm thick aluminum were determined as 250 GPa and 300 GPa, respectively.
Identifiants
pubmed: 37420980
pii: mi14040747
doi: 10.3390/mi14040747
pmc: PMC10143238
pii:
doi:
Types de publication
Journal Article
Langues
eng
Subventions
Organisme : the Ministry of Science and ICT, the Ministry of Trade, Industry and Energy, the Ministry of Health & Welfare, the Ministry of Food and Drug Safety
ID : 1711138281, KMDF_PR_20200901_0145
Organisme : the Bio & Medical Technology Development Program of the National Research Foundation (NRF)
ID : 2022M3E5E9016506 and 2022M3C1A3096446
Organisme : Korea Institute of Science and Technology (KIST) Institutional Program
ID : 2E32341
Références
Sci Rep. 2020 Mar 31;10(1):5728
pubmed: 32235886
Phys Rev Lett. 2004 Jul 16;93(3):034301
pubmed: 15323823
Adv Mater. 2011 Jan 18;23(3):349-68
pubmed: 20814918
Nat Mater. 2004 Aug;3(8):545-50
pubmed: 15247909
J Colloid Interface Sci. 2021 Jan 15;582(Pt A):227-235
pubmed: 32823124