A Sewing Approach to the Fabrication of Eco/bioresorbable Electronics.

eco/bioresorbable electronic devices eco/bioresorbable metal wires eco/bioresorbable stretchable interconnects embroidery wireless stretchable pacemaker

Journal

Small (Weinheim an der Bergstrasse, Germany)
ISSN: 1613-6829
Titre abrégé: Small
Pays: Germany
ID NLM: 101235338

Informations de publication

Date de publication:
Dec 2023
Historique:
revised: 15 07 2023
received: 14 06 2023
pubmed: 2 8 2023
medline: 2 8 2023
entrez: 1 8 2023
Statut: ppublish

Résumé

Eco/bioresorbable electronics represent an emerging class of technology defined by an ability to dissolve or otherwise harmlessly disappear in environmental or biological surroundings after a period of stable operation. The resulting devices provide unique capabilities as temporary biomedical implants, environmental sensors, and related systems. Recent publications report schemes to overcome challenges in fabrication that follow from the low thermostability and/or high chemical reactivity of the eco/bioresorbable constituent materials. Here, this work reports the use of high-speed sewing machines, as the basis for a high-throughput manufacturing technique that addresses many requirements for these applications, without the need for high temperatures or reactive solvents. Results demonstrate that a range of eco/bioresorbable metal wires and polymer threads can be embroidered into complex, user-defined conductive patterns on eco/bioresorbable substrates. Functional electronic components, such as stretchable interconnects and antennas are possible, along with fully integrated systems. Examples of the latter include wirelessly powered light-emitting diodes, radiofrequency identification tags, and temporary cardiac pacemakers. These advances add to a growing range of options in high-throughput, automated fabrication of eco/bioresorbable electronics.

Identifiants

pubmed: 37528504
doi: 10.1002/smll.202305017
doi:

Types de publication

Journal Article

Langues

eng

Sous-ensembles de citation

IM

Pagination

e2305017

Subventions

Organisme : Northwestern University's NUANCE Center
Organisme : SHyNE Resource
ID : NSF ECCS-2025633
Organisme : IIN
Organisme : Northwestern's MRSEC program
ID : NSF DMR-1720139

Informations de copyright

© 2023 The Authors. Small published by Wiley-VCH GmbH.

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Auteurs

Yunyun Wu (Y)

Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, 60208, USA.

Eric Rytkin (E)

Department of Biomedical Engineering, Northwestern University, Evanston, IL, 60208, USA.

Miles Bimrose (M)

Department of Mechanical Science and Engineering, University of Illinois Urbana-Champaign, Urbana, IL, 61801, USA.

Shupeng Li (S)

Department of Mechanical Engineering, Northwestern University, Evanston, IL, 60208, USA.

Yeon Sik Choi (YS)

Department of Materials Science and Engineering, Yonsei University, Seodaemun-gu, Seoul, 03722, Republic of Korea.

Geumbee Lee (G)

Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, 60208, USA.

Yue Wang (Y)

Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, 60208, USA.
Department of Biomedical Engineering, Northwestern University, Evanston, IL, 60208, USA.

Lichao Tang (L)

Department of Biomedical Engineering, Northwestern University, Evanston, IL, 60208, USA.

Micah Madrid (M)

Department of Biomedical Engineering, Northwestern University, Evanston, IL, 60208, USA.

Grace Wickerson (G)

Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, 60208, USA.
Department of Materials Science and Engineering, Northwestern University, Evanston, IL, 60208, USA.

Jan-Kai Chang (JK)

Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, 60208, USA.
Wearifi Inc, Evanston, IL, 60208, USA.

Jianyu Gu (J)

Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, 60208, USA.

Yamin Zhang (Y)

Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, 60208, USA.

Jiaqi Liu (J)

Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, 60208, USA.

Sameh Tawfick (S)

Department of Mechanical Science and Engineering, University of Illinois Urbana-Champaign, Urbana, IL, 61801, USA.

Yonggang Huang (Y)

Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, 60208, USA.
Department of Mechanical Engineering, Northwestern University, Evanston, IL, 60208, USA.

William P King (WP)

Department of Mechanical Science and Engineering, University of Illinois Urbana-Champaign, Urbana, IL, 61801, USA.

Igor R Efimov (IR)

Department of Biomedical Engineering, Northwestern University, Evanston, IL, 60208, USA.
Department of Medicine, Feinberg School of Medicine, Northwestern University, Chicago, IL, 60611, USA.

John A Rogers (JA)

Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, 60208, USA.
Department of Biomedical Engineering, Northwestern University, Evanston, IL, 60208, USA.
Department of Mechanical Engineering, Northwestern University, Evanston, IL, 60208, USA.
Department of Materials Science and Engineering, Northwestern University, Evanston, IL, 60208, USA.
Department of Electrical and Computer Engineering, Northwestern University, Evanston, IL, 60208, USA.
Department of Chemistry, Northwestern University, Evanston, IL, 60208, USA.
Department of Neurological Surgery, Feinberg School of Medicine, Northwestern University, Chicago, IL, 60611, USA.

Classifications MeSH