Thermally Conductive and Electrically Insulating Epoxy Composites Filled with Network-like Alumina In Situ Coated Graphene.

alumina epoxy composite graphene insulation thermal conductivity

Journal

Nanomaterials (Basel, Switzerland)
ISSN: 2079-4991
Titre abrégé: Nanomaterials (Basel)
Pays: Switzerland
ID NLM: 101610216

Informations de publication

Date de publication:
03 Aug 2023
Historique:
received: 26 06 2023
revised: 28 07 2023
accepted: 28 07 2023
medline: 12 8 2023
pubmed: 12 8 2023
entrez: 12 8 2023
Statut: epublish

Résumé

With the rapid development of the electronics industry, there is a growing demand for packaging materials that possess both high thermal conductivity (TC) and low electrical conductivity (EC). However, traditional insulating fillers such as boron nitride, aluminum nitride, and alumina (Al

Identifiants

pubmed: 37570558
pii: nano13152243
doi: 10.3390/nano13152243
pmc: PMC10420872
pii:
doi:

Types de publication

Journal Article

Langues

eng

Subventions

Organisme : National Natural Science Foundation of China
ID : No.52273063

Références

Nanoscale. 2013 Jul 7;5(13):5863-71
pubmed: 23695448
Nanotechnology. 2014 Mar 28;25(12):125707
pubmed: 24577240
Sci Rep. 2014 Mar 14;4:4375
pubmed: 24625497
Nanotechnology. 2021 Apr 2;32(14):142003
pubmed: 33049724

Auteurs

Ruicong Lv (R)

School of Materials Science and Engineering, HEDPS/Center for Applied Physics and Technology, Peking University, Beijing 100871, China.

Haichang Guo (H)

School of Materials Science and Engineering, HEDPS/Center for Applied Physics and Technology, Peking University, Beijing 100871, China.

Lei Kang (L)

School of Materials Science and Engineering, HEDPS/Center for Applied Physics and Technology, Peking University, Beijing 100871, China.

Akbar Bashir (A)

School of Materials Science and Engineering, HEDPS/Center for Applied Physics and Technology, Peking University, Beijing 100871, China.

Liucheng Ren (L)

School of Materials Science and Engineering, HEDPS/Center for Applied Physics and Technology, Peking University, Beijing 100871, China.

Hongyu Niu (H)

School of Materials Science and Engineering, HEDPS/Center for Applied Physics and Technology, Peking University, Beijing 100871, China.

Shulin Bai (S)

School of Materials Science and Engineering, HEDPS/Center for Applied Physics and Technology, Peking University, Beijing 100871, China.
Peking University Nanchang Innovation Institute, 14#1-2 Floor, High-Level Talent Industrial Park, High-Tech District, Nanchang 330000, China.

Classifications MeSH