Efficient removal of copper and silver ions in electroplating wastewater by magnetic-MOF-based hydrogel and a reuse case for photocatalytic application.

Adsorption Heavy metal Magnetic hydrogel Photocatalytic Resource utilization

Journal

Chemosphere
ISSN: 1879-1298
Titre abrégé: Chemosphere
Pays: England
ID NLM: 0320657

Informations de publication

Date de publication:
Nov 2023
Historique:
received: 30 06 2023
revised: 12 08 2023
accepted: 18 08 2023
medline: 11 9 2023
pubmed: 22 8 2023
entrez: 21 8 2023
Statut: ppublish

Résumé

Direct discharge of electroplating wastewater containing hazardous metal ions such as Cu

Identifiants

pubmed: 37604344
pii: S0045-6535(23)02154-9
doi: 10.1016/j.chemosphere.2023.139885
pii:
doi:

Substances chimiques

Copper 789U1901C5
Silver 3M4G523W1G
UiO-66 0
Wastewater 0
Hydrogels 0
Ions 0
Chitosan 9012-76-4

Types de publication

Journal Article

Langues

eng

Sous-ensembles de citation

IM

Pagination

139885

Informations de copyright

Copyright © 2023 Elsevier Ltd. All rights reserved.

Déclaration de conflit d'intérêts

Declaration of competing interest The authors declare that they have no known competing financial interests or personal relationships that could have appeared to influence the work reported in this paper.

Auteurs

Qiangting Zheng (Q)

School of Environmental and Geological Sciences, Shanghai Normal University, Shanghai, 200234, China.

Qinyi Li (Q)

School of Environmental and Geological Sciences, Shanghai Normal University, Shanghai, 200234, China.

Ying Tao (Y)

School of Environmental and Geological Sciences, Shanghai Normal University, Shanghai, 200234, China.

Jiamin Gong (J)

College of Chemistry and Materials Science, Shanghai Normal University, Shanghai, 200234, China.

Jiangli Shi (J)

College of Chemistry and Materials Science, Shanghai Normal University, Shanghai, 200234, China.

Yu Yan (Y)

College of Chemistry and Materials Science, Shanghai Normal University, Shanghai, 200234, China.

Xiaoyu Guo (X)

College of Chemistry and Materials Science, Shanghai Normal University, Shanghai, 200234, China. Electronic address: gxy2012@shnu.edu.cn.

Haifeng Yang (H)

College of Chemistry and Materials Science, Shanghai Normal University, Shanghai, 200234, China. Electronic address: hfyang@shnu.edu.cn.

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Classifications MeSH