Effect of Twist Angle on Interfacial Thermal Transport in Two-Dimensional Bilayers.

2D materials interface phonon thermal transport twist angle

Journal

Nano letters
ISSN: 1530-6992
Titre abrégé: Nano Lett
Pays: United States
ID NLM: 101088070

Informations de publication

Date de publication:
13 Sep 2023
Historique:
medline: 28 8 2023
pubmed: 28 8 2023
entrez: 28 8 2023
Statut: ppublish

Résumé

Advances in two-dimensional (2D) devices require innovative approaches for manipulating transport properties. Analogous to the electrical and optical responses, it has been predicted that thermal transport across 2D materials can have a similar strong twist-angle dependence. Here, we report experimental evidence deviating from this understanding. In contrast to the large tunability in electrical transport, we measured an unexpected weak twist-angle dependence of interfacial thermal transport in MoS

Identifiants

pubmed: 37638677
doi: 10.1021/acs.nanolett.3c01050
pmc: PMC10510572
doi:

Types de publication

Journal Article

Langues

eng

Sous-ensembles de citation

IM

Pagination

7790-7796

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Auteurs

Lenan Zhang (L)

Department of Mechanical Engineering, Massachusetts Institute of Technology, Cambridge, Massachusetts 02139, United States.

Yang Zhong (Y)

Department of Mechanical Engineering, Massachusetts Institute of Technology, Cambridge, Massachusetts 02139, United States.

Xiangyu Li (X)

Department of Mechanical Engineering, Massachusetts Institute of Technology, Cambridge, Massachusetts 02139, United States.

Ji-Hoon Park (JH)

Department of Electrical Engineering and Computer Science, Massachusetts Institute of Technology, Cambridge, Massachusetts 02139, United States.

Qichen Song (Q)

Department of Mechanical Engineering, Massachusetts Institute of Technology, Cambridge, Massachusetts 02139, United States.

Long Li (L)

Department of Mechanical and Energy Engineering, Southern University of Science and Technology, Shenzhen 518055, China.

Liang Guo (L)

Department of Mechanical and Energy Engineering, Southern University of Science and Technology, Shenzhen 518055, China.

Jing Kong (J)

Department of Electrical Engineering and Computer Science, Massachusetts Institute of Technology, Cambridge, Massachusetts 02139, United States.

Gang Chen (G)

Department of Mechanical Engineering, Massachusetts Institute of Technology, Cambridge, Massachusetts 02139, United States.

Classifications MeSH