A Wireless, Mechanically Flexible, 25μm-Thick, 65,536-Channel Subdural Surface Recording and Stimulating Microelectrode Array with Integrated Antennas.

CMOS Implantable MEA UWB WPT

Journal

2023 IEEE Symposium on VLSI Technology and Circuits
Titre abrégé: 2023 IEEE Symp VLSI Technol Circuits (2023)
Pays: United States
ID NLM: 9918663674806676

Informations de publication

Date de publication:
Jun 2023
Historique:
medline: 6 9 2023
pubmed: 6 9 2023
entrez: 6 9 2023
Statut: ppublish

Résumé

This paper presents a fully wireless microelectrode array (MEA) system-on-chip (SoC) with 65,536 electrodes for non-penetrative cortical recording and stimulation, featuring a total sensing area of 6.8mm×7.4mm with a 26.5μm×29μm electrode pitch. Sensing, data telemetry, and powering are monolithically integrated on a single chip, which is made mechanically flexible to conform to the surface of the brain by substrate removal to a total thickness of 25μm allowing it to be contained entirely in the subdural space under the skull.

Identifiants

pubmed: 37671168
doi: 10.23919/vlsitechnologyandcir57934.2023.10185321
pmc: PMC10478373
mid: NIHMS1915830
doi:

Types de publication

Journal Article

Langues

eng

Subventions

Organisme : NIDCD NIH HHS
ID : R01 DC019498
Pays : United States
Organisme : NINDS NIH HHS
ID : U01 NS099697
Pays : United States

Auteurs

Nanyu Zeng (N)

Columbia University, New York, NY, USA.

Taesung Jung (T)

Columbia University, New York, NY, USA.

Mohit Sharma (M)

Columbia University, New York, NY, USA.

Guy Eichler (G)

Columbia University, New York, NY, USA.

Jason Fabbri (J)

Columbia University, New York, NY, USA.

R James Cotton (RJ)

Northwestern University, Evanston, IL, USA.

Eleonora Spinazzi (E)

Columbia University, New York, NY, USA.

Brett Youngerman (B)

Columbia University, New York, NY, USA.

Luca Carloni (L)

Columbia University, New York, NY, USA.

Kenneth L Shepard (KL)

Columbia University, New York, NY, USA.

Classifications MeSH