A Wireless, Mechanically Flexible, 25μm-Thick, 65,536-Channel Subdural Surface Recording and Stimulating Microelectrode Array with Integrated Antennas.
CMOS
Implantable
MEA
UWB
WPT
Journal
2023 IEEE Symposium on VLSI Technology and Circuits
Titre abrégé: 2023 IEEE Symp VLSI Technol Circuits (2023)
Pays: United States
ID NLM: 9918663674806676
Informations de publication
Date de publication:
Jun 2023
Jun 2023
Historique:
medline:
6
9
2023
pubmed:
6
9
2023
entrez:
6
9
2023
Statut:
ppublish
Résumé
This paper presents a fully wireless microelectrode array (MEA) system-on-chip (SoC) with 65,536 electrodes for non-penetrative cortical recording and stimulation, featuring a total sensing area of 6.8mm×7.4mm with a 26.5μm×29μm electrode pitch. Sensing, data telemetry, and powering are monolithically integrated on a single chip, which is made mechanically flexible to conform to the surface of the brain by substrate removal to a total thickness of 25μm allowing it to be contained entirely in the subdural space under the skull.
Identifiants
pubmed: 37671168
doi: 10.23919/vlsitechnologyandcir57934.2023.10185321
pmc: PMC10478373
mid: NIHMS1915830
doi:
Types de publication
Journal Article
Langues
eng
Subventions
Organisme : NIDCD NIH HHS
ID : R01 DC019498
Pays : United States
Organisme : NINDS NIH HHS
ID : U01 NS099697
Pays : United States