Nonplanar 3D Printing of Epoxy Using Freeform Reversible Embedding.

3D printing epoxy freeform reversible embedding mechanical characterization non-planar printing

Journal

Advanced materials technologies
ISSN: 2365-709X
Titre abrégé: Adv Mater Technol
Pays: United States
ID NLM: 101717732

Informations de publication

Date de publication:
06 Apr 2023
Historique:
pmc-release: 06 04 2024
medline: 21 9 2023
pubmed: 21 9 2023
entrez: 21 9 2023
Statut: ppublish

Résumé

Thermally cured thermoset polymers such as epoxies are widely used in industry and manufacturing due to their thermal, chemical, and electrical resistance, and mechanical strength and toughness. However, it can be challenging to 3D print thermally cured thermosets without rheological modification because they tend to flow and not hold their shape when extruded due to cure times of minutes to hours. 3D printing inside a support bath addresses this by allowing the liquid polymer to be held in place until the thermoset is fully cured and expands the structures that can be printed as extrusion is not limited to layer-by-layer. Here we report the use of Freeform Reversible Embedding (FRE) to 3D print off-the-shelf thermoset epoxy into lattice structures using non-planar extrusion. To do this we investigate how extrusion direction in 3D space impacts epoxy filament morphology and fusion at filament intersections. Further, we show the advantages of this approach by using non-planar printing to produce lattice geometries that show ~4 times greater specific modulus compared to lattice structures printed using other materials and printing techniques.

Identifiants

pubmed: 37732106
doi: 10.1002/admt.202201542
pmc: PMC10508874
mid: NIHMS1870591
pii:
doi:

Types de publication

Journal Article

Langues

eng

Subventions

Organisme : NHLBI NIH HHS
ID : R43 HL154956
Pays : United States

Déclaration de conflit d'intérêts

Conflict of Interest: A.W.F. has an equity stake in FluidForm Inc., which is a startup company commercializing FRE 3D printing. FRE 3D printing is the subject of patent protection including U.S. Patent 10,150,258 and others held by Carnegie Mellon University and licensed to FluidForm, Inc.

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Auteurs

Neeha Dev Arun (ND)

Carnegie Mellon University, PA 15213, USA.

Humphrey Yang (H)

Carnegie Mellon University, PA 15213, USA.

Lining Yao (L)

Carnegie Mellon University, PA 15213, USA.

Adam W Feinberg (AW)

Carnegie Mellon University, PA 15213, USA.

Classifications MeSH