Photonic Integrated Circuit Based Temperature Sensor forOut-of-Autoclave Composite Parts Production Monitoring.

Bragg gratings PIC composites optical photonics production monitoring temperature sensor

Journal

Sensors (Basel, Switzerland)
ISSN: 1424-8220
Titre abrégé: Sensors (Basel)
Pays: Switzerland
ID NLM: 101204366

Informations de publication

Date de publication:
08 Sep 2023
Historique:
received: 27 07 2023
revised: 05 09 2023
accepted: 06 09 2023
medline: 28 9 2023
pubmed: 28 9 2023
entrez: 28 9 2023
Statut: epublish

Résumé

The use of composite materials has seen widespread adoption in modern aerospace industry. This has been facilitated due to their favourable mechanical characteristics, namely, low weight and high stiffness and strength. For broader implementation of those materials though, the out-of-autoclave production processes have to be optimized, to allow for higher reliability of the parts produced as well as cost reduction and improved production speed. This optimization can be achieved by monitoring and controlling resin filling and curing cycles. Photonic Integrated Circuits (PICs), and, in particular, Silicon Photonics, owing to their fast response, small size, ability to operate at higher temperatures, immunity to electromagnetic interference, and compatibility with CMOS fabrication techniques, can offer sensing solutions fulfilling the requirements for composite material production using carbon fibres. In this paper, we demonstrate a passive optical temperature sensor, based on a 220 nm height Silicon-on-Insulator platform, embedded in a composite tool used for producing RTM-6 composite parts of high quality (for use in the aerospace industry). The design methodology of the photonic circuit as well as the experimental results and comparison with the industry standard thermocouples during a thermal cycling of the tool are presented. The optical sensor exhibits high sensitivity (85 pm/°C), high linearity (R

Identifiants

pubmed: 37765822
pii: s23187765
doi: 10.3390/s23187765
pmc: PMC10538109
pii:
doi:

Types de publication

Journal Article

Langues

eng

Sous-ensembles de citation

IM

Subventions

Organisme : European Union's H2020 innovation program
ID : 871875

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Auteurs

Georgios Syriopoulos (G)

Photonics Communications Research Laboratory, National Technical University of Athens, 9 Iroon Polytechniou Street, Zografou, 15773 Athens, Greece.

Ioannis Poulopoulos (I)

Photonics Communications Research Laboratory, National Technical University of Athens, 9 Iroon Polytechniou Street, Zografou, 15773 Athens, Greece.

Charalampos Zervos (C)

Photonics Communications Research Laboratory, National Technical University of Athens, 9 Iroon Polytechniou Street, Zografou, 15773 Athens, Greece.

Evrydiki Kyriazi (E)

Photonics Communications Research Laboratory, National Technical University of Athens, 9 Iroon Polytechniou Street, Zografou, 15773 Athens, Greece.

Aggelos Poulimenos (A)

Engineering Technology Solutions E.E., 15344 Athens, Greece.

Michal Szaj (M)

Argotech a.s., Holubova 978, CZ-547 01 Náchod, Czech Republic.

Jeroen Missinne (J)

Center for Microsystem Technology (CMST), Ghent University and IMEC, Technologiepark 126, 9052 Ghent, Belgium.

Geert van Steenberge (G)

Center for Microsystem Technology (CMST), Ghent University and IMEC, Technologiepark 126, 9052 Ghent, Belgium.

Hercules Avramopoulos (H)

Photonics Communications Research Laboratory, National Technical University of Athens, 9 Iroon Polytechniou Street, Zografou, 15773 Athens, Greece.

Classifications MeSH