Facile constructing Ti

EMW absorption properties Heat dissipation Heterogeneous interface engineering Ti(3)C(2)T(x)/TiO(2)@C

Journal

Journal of colloid and interface science
ISSN: 1095-7103
Titre abrégé: J Colloid Interface Sci
Pays: United States
ID NLM: 0043125

Informations de publication

Date de publication:
15 Jan 2024
Historique:
received: 31 08 2023
revised: 12 10 2023
accepted: 16 10 2023
medline: 23 10 2023
pubmed: 23 10 2023
entrez: 22 10 2023
Statut: ppublish

Résumé

Optimizing and enhancing the performance of electromagnetic wave (EMW) absorption materials relies on the modification of their composition and structure through heterogeneous interface engineering. Ti

Identifiants

DOI: 10.1016/j.jcis.2023.10.076 PMID: 37867074
pubmed: 37867074
pii: S0021-9797(23)01988-4
doi: 10.1016/j.jcis.2023.10.076
pii:
doi:

Types de publication

Journal Article

Langues

eng

Sous-ensembles de citation

IM

Pagination

1483-1491

Informations de copyright

Copyright © 2023 Elsevier Inc. All rights reserved.

Déclaration de conflit d'intérêts

Declaration of Competing Interest The authors declare that they have no known competing financial interests or personal relationships that could have appeared to influence the work reported in this paper.

Auteurs

Huying Yan (H)

National Engineering Research Center of Electromagnetic Radiation Control Materials, Key Laboratory of Multi-spectral Absorbing Materials and Structures of Ministry of Education, State Key Laboratory of Electronic Thin Films and Integrated Devices, School of Electronic Science and Engineering, University of Electronic Science and Technology of China, Chengdu 611731, China.

Yang Guo (Y)

National Engineering Research Center of Electromagnetic Radiation Control Materials, Key Laboratory of Multi-spectral Absorbing Materials and Structures of Ministry of Education, State Key Laboratory of Electronic Thin Films and Integrated Devices, School of Electronic Science and Engineering, University of Electronic Science and Technology of China, Chengdu 611731, China; School of Electrical and Information Engineering, University of Panzhihua, Panzhihua 617000, China. Electronic address: guoyangchn@126.com.

Xingzhi Bai (X)

National Engineering Research Center of Electromagnetic Radiation Control Materials, Key Laboratory of Multi-spectral Absorbing Materials and Structures of Ministry of Education, State Key Laboratory of Electronic Thin Films and Integrated Devices, School of Electronic Science and Engineering, University of Electronic Science and Technology of China, Chengdu 611731, China.

Jiawei Qi (J)

National Engineering Research Center of Electromagnetic Radiation Control Materials, Key Laboratory of Multi-spectral Absorbing Materials and Structures of Ministry of Education, State Key Laboratory of Electronic Thin Films and Integrated Devices, School of Electronic Science and Engineering, University of Electronic Science and Technology of China, Chengdu 611731, China.

Haipeng Lu (H)

National Engineering Research Center of Electromagnetic Radiation Control Materials, Key Laboratory of Multi-spectral Absorbing Materials and Structures of Ministry of Education, State Key Laboratory of Electronic Thin Films and Integrated Devices, School of Electronic Science and Engineering, University of Electronic Science and Technology of China, Chengdu 611731, China. Electronic address: luhaipeng@uestc.edu.cn.

Classifications MeSH