Materials and Device Designs for Wireless Monitoring of Temperature and Thermal Transport Properties of Wound Beds during Healing.

bioresorbable sensor chronic wound temperature sensor thermal conductivity sensor wireless platform

Journal

Advanced healthcare materials
ISSN: 2192-2659
Titre abrégé: Adv Healthc Mater
Pays: Germany
ID NLM: 101581613

Informations de publication

Date de publication:
20 Nov 2023
Historique:
revised: 02 11 2023
received: 23 08 2023
pubmed: 20 11 2023
medline: 20 11 2023
entrez: 20 11 2023
Statut: aheadofprint

Résumé

Chronic wounds represent a major health risk for diabetic patients. Regeneration of such wounds requires regular medical treatments over periods that can extend for several months or more. Schemes for monitoring the healing process can provide important feedback to the patient and caregiver. Although qualitative indicators such as malodor or fever can provide some indirect information, quantitative measurements of the wound bed have the potential to yield important insights. The work presented here introduces materials and engineering designs for a wireless system that captures spatio-temporal temperature and thermal transport information across the wound continuously throughout the healing process. Systematic experimental and computational studies establish the materials aspects and basic capabilities of this technology. In vivo studies reveal that both the temperature and the changes in this quantity offer information on wound status, with indications of initial exothermic reactions and mechanisms of scar tissue formation. Bioresorbable materials serve as the foundations for versions of this device that create possibilities for monitoring on and within the wound site, in a way that bypasses the risks of physical removal.

Identifiants

pubmed: 37983897
doi: 10.1002/adhm.202302797
doi:

Types de publication

Journal Article

Langues

eng

Sous-ensembles de citation

IM

Pagination

e2302797

Subventions

Organisme : NIDDK NIH HHS
ID : R01DK131302
Pays : United States
Organisme : NIDDK NIH HHS
ID : R01DK131302
Pays : United States

Informations de copyright

© 2023 The Authors. Advanced Healthcare Materials published by Wiley-VCH GmbH.

Références

H. Schaefer, T. E. Redelmeier, Skin Barrier: Principles of Percutaneous Absorption, Karger AG, Basel, Switzerland 1996.
L. D. Gray, A. S. Kreger, J Infect Dis. 1987, 155, 236.
T. Rimmer, T. J. Fallon, E. M. Kohner, Br. J. Ophthalmol. 1989, 73, 1.
R. G. Frykberg, J. Banks, Adv Wound Care. 2015, 4, 560.
M. M. Martino, P. S. Briquez, E. Güç, F. Tortelli, W. W. Kilarski, S. Metzger, J. J. Rice, G. A. Kuhn, R. Müller, M. A. Swartz, J. A. Hubbell, Science. 2014, 343, 885.
D. R. Griffin, M. M. Archang, C.-H. Kuan, W. M. Weaver, J. S. Weinstein, A. C. Feng, A. Ruccia, E. Sideris, V. Ragkousis, J. Koh, M. V. Plikus, D. Di Carlo, T. Segura, P. O. Scumpia, Nat. Mater. 2021, 20, 560.
A. N. Dehkordi, F. Mirahmadi Babaheydari, M. Chehelgerdi, S. R. Dehkordi, Stem Cell Res Ther. 2019, 10, 111.
S. Gregor, Arch. Surg. 2008, 143, 189.
J. W. Song, H. Ryu, W. Bai, Z. Xie, A. Vázquez-Guardado, K. Nandoliya, R. Avila, G. Lee, Z. Song, J. Kim, M.-K. Lee, Y. Liu, M. Kim, H. Wang, Y. Wu, H.-J. Yoon, S. S. Kwak, J. Shin, K. Kwon, W. Lu, X. Chen, Y. Huang, G. A. Ameer, J. A. Rogers, Sci. Adv. 2023, 9, eade4687.
P. Salvo, V. Dini, F. Di Francesco, M. Romanelli, Wound Med. 2015, 8, 15.
S.-H. Lu, M. Samandari, C. Li, H. Li, D. Song, Y. Zhang, A. Tamayol, X. Wang, Sens. Actuators Rep. 2022, 4, 100075.
G. Power, Z. Moore, T. O'connor, J Wound Care. 2017, 26, 381.
Y. Gao, D. T. Nguyen, T. Yeo, S. B. Lim, W. X. Tan, L. E. Madden, L. Jin, J. Y. K. Long, F. A. B. Aloweni, Y. J. A. Liew, M. L. L. Tan, S. Y. Ang, S. D. Maniya, I. Abdelwahab, K. P. Loh, C.-H. Chen, D. L. Becker, D. Leavesley, J. S. Ho, C. T. Lim, Sci. Adv. 2021, 7, eabg9614.
L. R. Bennison, C. N. Miller, R. J. Summers, A. M. B. Minnis, G. Sussman, W. McGuiness, Wound Pract. Res. 2017, 25, 63.
P. Bhushan, Y. Umasankar, S. Roychoudhury, P. A. Hirt, F. E. Macquhaec, L. J. Borda, H. A. Lev-Tov, R. S. Kirsner, S. Bhansali, J. Electrochem. Soc. 2019, 166, B830.
N. T. Garland, J. W. Song, T. Ma, Y. J. Kim, A. Vázquez-Guardado, A. B. Hashkavayi, S. K. Ganeshan, N. Sharma, H. Ryu, M.-K. Lee, B. Sumpio, M. A. Jakus, V. Forsberg, R. Kaveti, S. K. Sia, A. Veves, J. A. Rogers, G. A. Ameer, A. J. Bandodkar, Adv. Healthcare Mater. 2023, 12, 2301280.
S. E. Gardner, R. A. Frantz, C. Troia, S. Eastman, M. MacDonald, K. Buresh, D. Healy, Ostomy Wound Manage. 2001, 47, 40.
A. A. Lombardi, A. A. Gibb, E. Arif, D. W. Kolmetzky, D. Tomar, T. S. Luongo, P. Jadiya, E. K. Murray, P. K. Lorkiewicz, G. Hajnóczky, E. Murphy, Z. P. Arany, D. P. Kelly, K. B. Margulies, B. G. Hill, J. W. Elrod, Nat. Commun. 2019, 10, 4509.
B. B. Lowell, B. M. Spiegelman, Nature. 2000, 404, 652.
D. Wang, Y. Liu, Y.-R. Zhao, J.-L. Zhou, Chin. J. Traumatol. 2016, 19, 193.
Y. Jiang, A. A. Trotsyuk, S. Niu, D. Henn, K. Chen, C.-C. Shih, M. R. Larson, A. M. Mermin-Bunnell, S. Mittal, J.-C. Lai, A. Saberi, E. Beard, S. Jing, D. Zhong, S. R. Steele, K. Sun, T. Jain, E. Zhao, C. R. Neimeth, W. G. Viana, J. Tang, D. Sivaraj, J. Padmanabhan, M. Rodrigues, D. P. Perrault, A. Chattopadhyay, Z. N. Maan, M. C. Leeolou, C. A. Bonham, S. H. Kwon, et al., Nat. Biotechnol. 2023, 41, 652.
E. S. Sani, C. Xu, C. Wang, Y. Song, J. Min, J. Tu, S. A. Solomon, J. Li, J. L. Banks, D. G. Armstrong, W. Gao, Sci. Adv. 2023, 9, eadf7388.
G. Gethin, J. D. Ivory, D. Sezgin, H. Muller, G. O'connor, A. Vellinga, Wound Repair Regen. 2021, 29, 843.
J. Glik, A. Cholewka, A. Stanek, K. Sieron, K. Mikus-Zagórska, G. Knefel, M. Nowak, M. Kawecki, Adv. Clin. Exp. Med. 2019, 28, 229.
K. Kwon, J. U. Kim, Y. Deng, S. R. Krishnan, J. Choi, H. Jang, K. Lee, C.-J. Su, I. Yoo, Y. Wu, L. Lipschultz, J.-H. Kim, T. S. Chung, D. Wu, Y. Park, T.-I. Kim, R. Ghaffari, S. Lee, Y. Huang, J. A. Rogers, Nat. Electron. 2021, 4, 302.
J. Shin, H. Wang, K. Kwon, D. Ostojich, Z. Christiansen, J. Berkovich, Y. Park, Z. Li, G. Lee, R. Nasif, T. S. Chung, C.-J. Su, J. Lim, H. Kubota, A. Ikoma, Y.-A. Lu, D. H. Lin, S. Xu, A. Banks, J.-K. Chang, J. A. Rogers, Adv. Healthcare Mater. 2023, 12, e2202021.
K. Kwon, H. Wang, J. Lim, K. S. Chun, H. Jang, I. Yoo, D. Wu, A. J. Chen, C. G. Gu, L. Lipschultz, J. U. Kim, J. Kim, H. Jeong, H. Luan, Y. Park, C. J. Su, Y. Ishida, S. R. Madhvapathy, A. Ikoma, J. W. Kwak, D. S. Yang, A. Banks, S. Xu, Y. Huang, J. K. Chang, J. A. Rogers, Proc. Natl. Acad. Sci. USA 2021, 118, e2020398118.
A. R. Moritz, F. C. Henriques, Am. J. Pathol. 1947, 23, 695.
G. Gethin, J. D. Ivory, D. Sezgin, H. Muller, G. O'connor, A. Vellinga, Wound Repair Regen. 2021, 29, 843.
A. J. Ali, B. E. Eddin, M. T. Chaichan, Therm. Sci. Eng. Prog. 2021, 25, 100985.
S. Krishnan, Y. Shi, R. C. Webb, Y. Ma, P. Bastien, K. E. Crawford, A. Wang, X. Feng, M. Manco, J. Kurniawan, E. Tir, Y. Huang, G. Balooch, R. M. Pielak, J. A. Rogers, Microsyst. Nanoeng. 2017, 3, 17014.
G. Lee, M. D. Does, R. Avila, J. Kang, K. D. Harkins, Y. Wu, W. E. Banks, M. Park, D. Lu, X. Yan, J. U. Kim, S. M. Won, A. G. Evans, J. T. Joseph, C. L. Kalmar, A. C. Pollins, H. Karagoz, W. P. Thayer, Y. Huang, J. A. Rogers, Adv. Sci. 2023, https://doi.org/10.1002/advs.202301232.
H. Ryu, M.-H. Seo, J. A. Rogers, Adv. Healthcare Mater. 2021, 10, 2002236.
W. Bai, M. Irie, Z. Liu, H. Luan, D. Franklin, K. Nandoliya, H. Guo, H. Zang, Y. Weng, D. Lu, D. Wu, Y. Wu, J. Song, M. Han, E. Song, Y. Yang, X. Chen, H. Zhao, W. Lu, G. Monti, I. Stepien, I. Kandela, C. R. Haney, C. Wu, S. M. Won, H. Ryu, A. Rwei, H. Shen, J. Kim, H.-J. Yoon, et al., BME Front. 2021, 2021, 8653218.
W. Jo, H. Lee, Y. Lee, B.-S. Bae, T.-S. Kim, Adv. Eng. Mater. 2021, 23, 2001280.
Y. S. Choi, J. Koo, Y. J. Lee, G. Lee, R. Avila, H. Ying, J. Reeder, L. Hambitzer, K. Im, J. Kim, K.-M. Lee, J. Cheng, Y. Huang, S.-K. Kang, J. A. Rogers, Adv. Funct. Mater. 2020, 30, 2000941.
A. Chanmugam, D. Langemo, K. Thomason, J. Haan, E. A. Altenburger, A. Tippett, L. Henderson, T. A. Zortman, Adv. Skin Wound Care. 2017, 30, 406.
R. D. Galiano, J. V. Michaels, M. Dobryansky, J. P. Levine, G. C. Gurtner, Wound Repair Regen. 2004, 12, 485.

Auteurs

Hanjun Ryu (H)

Department of Advanced Materials Engineering, Chung-Ang University, Anseong, 17546, Republic of Korea.
Department of Intelligence Energy and Industry, Chung-Ang University, Seoul, 06974, Republic of Korea.

Joseph W Song (JW)

Department of Biomedical Engineering, Northwestern University, Evanston, IL, 60208, USA.
Center for Advanced Regenerative Engineering, Northwestern University, Evanston, IL, 60208, USA.
Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, 60208, USA.

Haiwen Luan (H)

Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, 60208, USA.
Department of Mechanical and Aerospace Engineering, University of California, San Diego, La Jolla, CA, 92093, USA.

Youngmin Sim (Y)

School of Electrical Engineering, Korea Advanced Institute of Science and Technology, Daejeon, 34141, Republic of Korea.

Sung Soo Kwak (SS)

Center for Bionics of Biomedical Research Institute, Korea Institute of Science and Technology, Seoul, 02456, Republic of Korea.

Hokyung Jang (H)

Science Corp. 1010 Atlantic Ave. 100, Alameda, CA, 94501, USA.

Young Jin Jo (YJ)

Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, 60208, USA.

Hong-Joon Yoon (HJ)

Department of Electronic Engineering, Gachon University, Seongnam, 13120, Republic of Korea.

Hyoyoung Jeong (H)

Department of Electrical and Computer Engineering, University of California, Davis, Davis, CA, 95616, USA.

Jaeho Shin (J)

Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, 60208, USA.

Do Yun Park (DY)

School of Electrical Engineering, Korea Advanced Institute of Science and Technology, Daejeon, 34141, Republic of Korea.

Kyeongha Kwon (K)

School of Electrical Engineering, Korea Advanced Institute of Science and Technology, Daejeon, 34141, Republic of Korea.

Guillermo Antonio Ameer (GA)

Department of Biomedical Engineering, Northwestern University, Evanston, IL, 60208, USA.
Center for Advanced Regenerative Engineering, Northwestern University, Evanston, IL, 60208, USA.
Department of Surgery, Feinberg School of Medicine, Northwestern University, Chicago, IL, 60611, USA.
Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, 60208, USA.
Chemistry of Life Processes Institute, Northwestern University, Evanston, IL, 60208, USA.
International Institute for Nanotechnology, Northwestern University, Evanston, IL, 60208, USA.
Simpson Querrey Institute for Bionanotechnology, Evanston, IL, 60208, USA.

John A Rogers (JA)

Department of Biomedical Engineering, Northwestern University, Evanston, IL, 60208, USA.
Center for Advanced Regenerative Engineering, Northwestern University, Evanston, IL, 60208, USA.
Department of Surgery, Feinberg School of Medicine, Northwestern University, Chicago, IL, 60611, USA.
Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, 60208, USA.
Chemistry of Life Processes Institute, Northwestern University, Evanston, IL, 60208, USA.
International Institute for Nanotechnology, Northwestern University, Evanston, IL, 60208, USA.
Simpson Querrey Institute for Bionanotechnology, Evanston, IL, 60208, USA.
Department of Mechanical Engineering, Northwestern University, Evanston, IL, 60208, USA.
Department of Materials Science and Engineering, Northwestern University, Evanston, IL, 60208, USA.
Department of Neurological Surgery, Feinberg School of Medicine, Northwestern University, Evanston, IL, 60208, USA.

Classifications MeSH