Systematic Investigation of Novel, Controlled Low-Temperature Sintering Processes for Inkjet Printed Silver Nanoparticle Ink.
capping agent
inkjet printing
low-temperature sintering
neck formation
printed electronics
silver nanoparticle
Journal
Small (Weinheim an der Bergstrasse, Germany)
ISSN: 1613-6829
Titre abrégé: Small
Pays: Germany
ID NLM: 101235338
Informations de publication
Date de publication:
21 Dec 2023
21 Dec 2023
Historique:
revised:
28
11
2023
received:
10
08
2023
medline:
21
12
2023
pubmed:
21
12
2023
entrez:
21
12
2023
Statut:
aheadofprint
Résumé
Functional inks enable manufacturing of flexible electronic devices by means of printing technology. Silver nanoparticle (Ag NP) ink is widely used for printing conductive components. A sintering process is required to obtain sufficient conductivity. Thermal sintering is the most commonly used method, but the heat must be carefully applied to avoid damaging low-temperature substrates such as polymer films. In this work, two alternative sintering methods, damp heat sintering and water sintering are systematically investigated for inkjet-printed Ag tracks on polymer substrates. Both methods allow sintering polyvinyl pyrrolidone (PVP) capped Ag NPs at 85°C. In this way, the resistance is significantly reduced to only 1.7 times that of the samples on polyimide sintered in an oven at 250°C. The microstructure of sintered Ag NPs is analyzed. Taking the states of the capping layer under different conditions into account, the explanation of the sintering mechanism of Ag NPs at low temperatures is presented. Overall, both damp heat sintering and water sintering are viable options for achieving high conductivity of printed Ag tracks. They can broaden the range of substrates available for flexible electronic device fabrication while mitigating substrate damage risks. The choice between them depends on the specific application and the substrate used.
Identifiants
pubmed: 38126669
doi: 10.1002/smll.202306865
doi:
Types de publication
Journal Article
Langues
eng
Sous-ensembles de citation
IM
Pagination
e2306865Subventions
Organisme : Helmholtz Association
Informations de copyright
© 2023 The Authors. Small published by Wiley-VCH GmbH.
Références
L.-W. Lo, H. Shi, H. Wan, Z. Xu, X. Tan, C. Wang, Adv. Mater. Technol. 2019, 5, 1900717.
J. Zikulnig, C. Hirschl, L. Rauter, M. Krivec, H. Lammer, F. Riemelmoser, A. Roshanghias, Flexible Printed Electron. 2019, 4, 015008.
S. K. Karunakaran, G. M. Arumugam, W. Yang, S. Ge, S. N. Khan, X. Lin, G. Yang, J. Mater. Chem. A 2019, 7, 13873.
P. G. V. Sampaio, M. O. A. González, P. O. Ferreira, P. C. J. Vidal, J. P. P. Pereira, H. R. Ferreira, P. C. Oprime, Int. J. Energy Res. 2020, 44, 9912.
M. Hengge, K. Livanov, N. Zamoshchik, F. Hermerschmidt, E. J. W. List-Kratochvil, Flexible Printed Electron. 2021, 6, 015009.
Y. Murat, K. Petersons, D. Lanka, L. Lindvold, L. Yde, J. Stensborg, M. Gerken, Mater. Adv. 2020, 1, 2755.
X. Du, S. P. Wankhede, S. Prasad, A. Shehri, J. Morse, N. Lakal, J. Mater. Chem. C 2022, 10, 14091.
U. Gengenbach, M. Ungerer, L. Koker, K.-M. Reichert, P. Stiller, S. Allgeier, B. Köhler, X. Zhu, C. Huang, V. Hagenmeyer, Mechatronics 2020, 70, 102403.
M. Ungerer, Dissertation, Karlsruhe Institute of Technology, Karlsruhe, 2020.
A. Sharif, J. Ouyang, A. Raza, M. A. Imran, Q. H. Abbasi, Microwave Opt. Tech. Lett. 2019, 61, 2161.
V. K. R. Rao, A. K. Venkata, P. S. Karthik, S. P. Singh, RSC Adv. 2015, 5, 77760.
Q. Huang, Y. Zhu, Adv. Mater. Technol. 2019, 4, 1800546.
L. Mo, Z. Guo, L. Yang, Q. Zhang, Y. Fang, Z. Xin, Z. Chen, K. Hu, L. Han, L. Li, Int. J. Mol. Sci. 2019, 20, 2124.
K.-S. Chou, K.-C. Huang, H.-H. Lee, Nanotechnology 2005, 16, 779.
J. R. Greer, R. A. Street, Acta Mater. 2007, 55, 6345.
W. Luo, W. Hu, S. Xiao, J. Phys. Chem. C 2008, 112, 2359.
A. Denneulin, A. Blayo, C. Neuman, J. Bras, J. Nanopart. Res. 2011, 13, 3815.
J. S. Kang, J. Ryu, H. S. Kim, H. T. Hahn, J. Electron. Mater. 2011, 40, 2268.
Y.-R. Jang, S.-J. Joo, J.-H. Chu, H.-J. Uhm, J.-W. Park, C.-H. Ryu, M.-H. Yu, H.-S. Kim, Int. J. Prec. Eng. Manuf.-Green Tech. 2020, 8, 327.
A. Chiolerio, G. Maccioni, P. Martino, M. Cotto, P. Pandolfi, P. Rivolo, S. Ferrero, L. Scaltrito, Microelectron. Eng. 2011, 88, 2481.
O. Ermak, M. Zenou, G. B. Toker, J. Ankri, Y. Shacham-Diamand, Z. Kotler, Nanotechnology 2016, 27, 385201.
W. Gu, W. Yuan, T. Zhong, X. Wu, C. Zhou, J. Lin, Z. Cui, RSC Adv. 2018, 8, 30215.
B. J. Perelaer, A. W. M. de Laat, C. E. Hendriks, U. S. Schubert, J. Mater. Chem. 2008, 18, 3209.
M. J. Renn, M. Schrandt, J. Renn, J. Q. Feng, J. Microelectron. Electron. Packag. 2017, 14, 132.
X. Zhao, Z. Deng, W. Zhao, B. Feng, M. Wang, M. Huang, L. Liu, G. Zou, Y. Shao, H. Zhu, Nanoscale 2020, 12, 19413.
I. Lee, A. Hussain, H.-L. Lee, Y.-J. Moon, J.-Y. Hwang, S.-J. Moon, Metals 2021, 11, 1878.
M. Allen, A. Alastalo, M. Suhonen, T. Mattila, J. Leppaniemi, H. Seppa, IEEE Trans. Microwave Theory Tech. 2011, 59, 1419.
J. Perelaer, B.-J. de Gans, U. Schubert, Adv. Mater. 2006, 18, 2101.
D. Corzo, G. Tostado-Blázquez, D. Baran, Front. Electron. 2020, 1, 594003.
V. Zardetto, T. M. Brown, A. Reale, A. Di Carlo, J. Polym. Sci., Part B: Polym. Phys. 2011, 49, 638.
S. Magdassi, M. Grouchko, O. Berezin, A. Kamyshny, ACS Nano 2010, 4, 1943.
Y. Tang, W. He, G. Zhou, S. Wang, X. Yang, Z. Tao, J. Zhou, Nanotechnology 2012, 23, 355304.
D. C. Corsino, M. D. L. Balela, IOP Conf. Ser.: Mater. Sci. Eng. 2017, 264, 012020.
P. Peng, L. Li, W. Guo, Z. Hui, J. Fu, C. Jin, Y. Liu, Y. Zhu, J. Phys. Chem. C 2018, 122, 2704.
Y. Xiao, Z. Zhang, M. Yang, H. Yang, M. Li, Y. Cao, Mater. Lett. 2018, 222, 16.
J. Olkkonen, J. Leppäniemi, T. Mattila, K. Eiroma, J. Mater. Chem. C 2014, 2, 3577.
Y. Yang, S. Duan, H. Zhao, Nanoscale 2022, 14, 11484.
J. Bourassa, A. Ramm, J. Q. Feng, M. J. Renn, SN Appl. Sci. 2019, 1, 6.
M. Allen, J. Leppäniemi, M. Vilkman, A. Alastalo, T. Mattila, Nanotechnology 2010, 21, 475204.
M. Ungerer, W. Spomer, I. Wacker, R. Schröder, U. Gengenbach, Int. J. Adv. Intell. Syst. 2017, 10, 383.
L. Tan, X. Zheng, L. Chen, Y. Wang, J. Sep. Sci. 2014, 37, 2974.
K. Li, C. Li, H. Li, M. Li, Y. Song, iScience 2021, 24, 102121.
C. Ma, M. J. Trujillo, J. P. Camden, ACS Appl. Mater. Interfaces 2016, 8, 23978.
A. Rónavári, P. Bélteky, E. Boka, D. Zakupszky, N. Igaz, B. Szerencsés, I. Pfeiffer, Z. Kónya, M. Kiricsi, Int. J. Mol. Sci. 2021, 22, 8673.
M. Kumar, P. Devi, V. D. Shivling, Mater. Res. Express 2017, 4, 085006.
T.-H. Yang, J. Ahn, S. Shi, D. Qin, ACS Nano 2021, 15, 14242.
A. Jarray, V. Gerbaud, M. Hemati, Prog. Org. Coat. 2016, 101, 195.
F. Haaf, A. Sanner, F. Straub, Polym. J. 1985, 17, 143.
S. Fitzpatrick, J. F. McCabe, C. R. Petts, S. W. Booth, Int. J. Pharm. 2002, 246, 143.
S. Bhattacharya, D. K. Sharma, S. Saurabh, S. De, A. Sain, A. Nandi, A. Chowdhury, J. Phys. Chem. B 2013, 117, 7771.
R. B. Heady, J. W. Cahn, Metall. Trans. 1970, 1, 1.
The international association for the properties of water and steam (iapws), http://www.iapws.org/ (accessed: April 2023).
W. Cui, W. Lu, Y. Zhang, G. Lin, T. Wei, L. Jiang, Colloids Surf. A 2010, 358, 35.
H. R. Tiyyagura, P. Majerič, M. Bračič, I. Anžel, R. Rudolf, Nanomaterials 2021, 11, 599.
W. Li, Q. Cen, W. Li, Z. Zhao, W. Yang, Y. Li, M. Chen, G. Yang, J. Yang, J. Mater. 2020, 6, 300.
H. Andersson, A. Manuilskiy, T. Unander, C. Lidenmark, S. Forsberg, H.-E. Nilsson, IEEE Sens. J. 2012, 12, 1901.
S. Kim, S. Won, G.-D. Sim, I. Park, S.-B. Lee, Nanotechnology 2013, 24, 085701.
W. A. MacDonald, R. Eveson, D. MacKerron, R. Adam, K. Rollins, R. Rustin, M. K. Looney, J. Stewart, K. Hashimoto, SID Symp. Digest Tech. Papers 2007, 38, 373.
J. Smith, R. Hamilton, I. McCulloch, M. Heeney, J. E. Anthony, D. D. Bradley, T. D. Anthopoulos, Synth. Met. 2009, 159, 2365.