Miniature Ultrasonic Spatial Localization Module in the Lightweight Interactive.

blind spot free measurement lightweight interactive piezoelectric micromechanical ultrasonic transducers (PMUT) spatial localization

Journal

Micromachines
ISSN: 2072-666X
Titre abrégé: Micromachines (Basel)
Pays: Switzerland
ID NLM: 101640903

Informations de publication

Date de publication:
29 Dec 2023
Historique:
received: 25 11 2023
revised: 24 12 2023
accepted: 27 12 2023
medline: 23 1 2024
pubmed: 23 1 2024
entrez: 23 1 2024
Statut: epublish

Résumé

The advancement of spatial interaction technology has greatly enriched the domain of consumer electronics. Traditional solutions based on optical technologies suffers high power consumption and significant costs, making them less ideal in lightweight implementations. In contrast, ultrasonic solutions stand out due to their lower power consumption and cost-effectiveness, capturing widespread attention and interest. This paper addresses the challenges associated with the application of ultrasound sensors in spatial localization. Traditional ultrasound systems are hindered by blind spots, large physical dimensions, and constrained measurement ranges, limiting their practical applicability. To overcome these limitations, this paper proposes a miniature ultrasonic spatial localization module employing piezoelectric micromechanical ultrasonic transducers (PMUTs). The module is comprised of three devices each with dimension of 1.2 mm × 1.2 mm × 0.5 mm, operating at a frequency of around 180 kHz. This configuration facilitates a comprehensive distance detection range of 0-800 mm within 80° directivity, devoid of blind spot. The error rate and failure range of measurement as well as their relationship with the SNR (signal-to-noise ratio) are also thoroughly investigated. This work heralds a significant enhancement in hand spatial localization capabilities, propelling advancements in acoustic sensor applications of the meta-universe.

Identifiants

pubmed: 38258190
pii: mi15010071
doi: 10.3390/mi15010071
pii:
doi:

Types de publication

Journal Article

Langues

eng

Auteurs

Lieguang Li (L)

School of Microelectronics, Shanghai University, Shanghai 200444, China.

Xueying Xiu (X)

School of Microelectronics, Shanghai University, Shanghai 200444, China.

Haochen Lyu (H)

Department of Materials Science and Engineering in Rutgers, The State University of New Jersey, Piscataway, NJ 08854, USA.

Haolin Yang (H)

School of Microelectronics, Shanghai University, Shanghai 200444, China.

Ahmad Safari (A)

Department of Materials Science and Engineering in Rutgers, The State University of New Jersey, Piscataway, NJ 08854, USA.

Songsong Zhang (S)

School of Microelectronics, Shanghai University, Shanghai 200444, China.

Classifications MeSH